发明授权
- 专利标题： Method of forming a solder ball on a board and the board
- 专利标题（中）： 在板和板上形成焊球的方法
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申请号： US11196243申请日： 2005-08-04
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公开(公告)号： US07213329B2公开(公告)日： 2007-05-08
- 发明人: Seung-Woo Kim , Pyeong-Wan Kim , Sang-Ho Ahn , Bo-Seong Kim , Ho-Jeong Mun , Tae-Seong Park , Hee-Guk Choi
- 申请人： Seung-Woo Kim , Pyeong-Wan Kim , Sang-Ho Ahn , Bo-Seong Kim , Ho-Jeong Mun , Tae-Seong Park , Hee-Guk Choi
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electronics, Co., Ltd.
- 当前专利权人： Samsung Electronics, Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, PLC
- 优先权： KR10-2004-0064118 20040814; KR10-2005-0051263 20050615
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K3/40 ; H05K7/06 ; H01L21/44
摘要：
In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
公开/授权文献
- US20060035453A1 Method of forming a solder ball on a board and the board 公开/授权日：2006-02-16
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