Invention Grant
US07250320B2 Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
失效
半导体发光元件及其制造方法,集成半导体发光元件及其制造方法,图像显示装置及其制造方法,照明装置及其制造方法
- Patent Title: Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
- Patent Title (中): 半导体发光元件及其制造方法,集成半导体发光元件及其制造方法,图像显示装置及其制造方法,照明装置及其制造方法
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Application No.: US10512131Application Date: 2004-02-19
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Publication No.: US07250320B2Publication Date: 2007-07-31
- Inventor: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Jun Suzuki , Toyoharu Oohata
- Applicant: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Jun Suzuki , Toyoharu Oohata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Bell, Boyd & Lloyd LLP
- Priority: JP2003-077703 20030320
- International Application: PCT/JP2004/001952 WO 20040219
- International Announcement: WO2004/084318 WO 20040930
- Main IPC: H01L29/22
- IPC: H01L29/22

Abstract:
A semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, illuminating device, and manufacturing method thereof are provided.An n-type GaN layer is grown on a sapphire substrate, and a growth mask of SiN, for example, is formed thereon. On the n-type GaN layer exposed through an opening in the growth mask, a six-sided steeple-shaped n-type GaN layer is selectively grown, which has inclined crystal planes each composed of a plurality of crystal planes inclined from the major surface of the sapphire substrate by different angles of inclination to exhibit a convex plane as a whole. On the n-type GaN layer, an active layer and a p-type GaN layer are grown to make a light emitting element structure. Thereafter, a p-side electrode and an n-side electrode are formed.
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