发明授权
- 专利标题： Current-leveling electroplating/electropolishing electrode
- 专利标题（中）： 电流调平电镀/电解抛光电极
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申请号： US12854214申请日： 2010-08-11
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公开(公告)号： US08099861B2公开(公告)日： 2012-01-24
- 发明人: Shih-Chieh Chang , Ying-Lang Wang , Kei-Wei Chen , Shih-Ho Lin , Chun-Chang Chen
- 申请人： Shih-Chieh Chang , Ying-Lang Wang , Kei-Wei Chen , Shih-Ho Lin , Chun-Chang Chen
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW
- 代理机构： Tung & Associates
- 主分类号： B23P19/02
- IPC分类号： B23P19/02 ; B23P19/04 ; B23P19/10 ; B23P19/12 ; C25D17/12 ; C25D17/14 ; C25D3/38
摘要：
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
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