发明授权
- 专利标题: High performance CMOS circuits, and methods for fabricating same
- 专利标题(中): 高性能CMOS电路及其制造方法
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申请号: US12541562申请日: 2009-08-14
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公开(公告)号: US08383483B2公开(公告)日: 2013-02-26
- 发明人: John C. Arnold , Glenn A. Biery , Alessandro C. Callegari , Tze-Chiang Chen , Michael P. Chudzik , Bruce B. Doris , Michael A. Gribelyuk , Young-Hee Kim , Barry P. Linder , Vijay Narayanan , Joseph S. Newbury , Vamsi K. Paruchuri , Michelle L. Steen
- 申请人: John C. Arnold , Glenn A. Biery , Alessandro C. Callegari , Tze-Chiang Chen , Michael P. Chudzik , Bruce B. Doris , Michael A. Gribelyuk , Young-Hee Kim , Barry P. Linder , Vijay Narayanan , Joseph S. Newbury , Vamsi K. Paruchuri , Michelle L. Steen
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Louis J. Percello, Esq.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
The present invention relates to complementary metal-oxide-semiconductor (CMOS) circuits that each contains at least a first and a second gate stacks. The first gate stack is located over a first device region (e.g., an n-FET device region) in a semiconductor substrate and comprises at least, from bottom to top, a gate dielectric layer, a metallic gate conductor, and a silicon-containing gate conductor. The second gate stack is located over a second device region (e.g., a p-FET device region) in the semiconductor substrate and comprises at least, from bottom to top, a gate dielectric layer and a silicon-containing gate conductor. The first and second gate stacks can be formed over the semiconductor substrate in an integrated manner by various methods of the present invention.
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