Invention Grant
- Patent Title: Mesh electrode adhesion structure, electron emission device and electronic apparatus including the electron emission device
- Patent Title (中): 网状电极粘附结构，电子发射装置和包括电子发射装置的电子装置
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Application No.: US13893519Application Date: 2013-05-14
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Publication No.: US08938049B2Publication Date: 2015-01-20
- Inventor: Do-yoon Kim , Yong-chul Kim , Il-hwan Kim , Shang-hyeun Park , Tae-won Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2012-0074107 20120706
- Main IPC: H01J35/06
- IPC: H01J35/06 ; H01J29/50 ; H01J19/24 ; H01J1/02 ; H01J3/02 ; H01J31/12 ; H01J63/02 ; H01J9/02 ; H01J63/06 ; B82Y99/00
Abstract:
A mesh electrode adhesion structure includes: a substrate, and an opening defined in the substrate; a mesh electrode on the substrate, and a first combination groove defined in the mesh electrode; and an adhesion layer between the substrate and the mesh electrode. The mesh electrode includes: a mesh region corresponding to the opening defined in the substrate, and an adhesion region in which the first combination groove exposes the adhesion layer.
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