Invention Grant
US09287279B2 Silicon nitride (SiN) encapsulating layer for silicon nanocrystal memory storage
有权
用于硅纳米晶体存储器的氮化硅(SiN)封装层
- Patent Title: Silicon nitride (SiN) encapsulating layer for silicon nanocrystal memory storage
- Patent Title (中): 用于硅纳米晶体存储器的氮化硅(SiN)封装层
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Application No.: US14225874Application Date: 2014-03-26
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Publication No.: US09287279B2Publication Date: 2016-03-15
- Inventor: Yu-Hsing Chang , Chang-Ming Wu , Shih-Chang Liu , Chia-Shiung Tsai , Ru-Liang Lee , Wei Cheng Wu , Harry-Hak-Lay Chuang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/788 ; H01L21/28

Abstract:
Some embodiments relate to a memory cell with a charge-trapping layer of nanocrystals, comprising a tunneling oxide layer along a select gate, a control oxide layer formed between a control gate and the tunnel oxide layer, and a plurality of nanocrystals arranged between the tunneling and control oxide layers. An encapsulating layer isolates the nanocrystals from the control oxide layer. Contact formation to the select gate includes a two-step etch. A first etch includes a selectivity between oxide and the encapsulating layer, and etches away the control oxide layer while leaving the encapsulating layer intact. A second etch, which has an opposite selectivity of the first etch, then etches away the encapsulating layer while leaving the tunneling oxide layer intact. As a result, the control oxide layer and nanocrystals are etched away from a surface of the select gate, while leaving the tunneling oxide layer intact for contact isolation.
Public/Granted literature
- US20150279849A1 SILICON NITRIDE (SiN) ENCAPSULATING LAYER FOR SILICON NANOCRYSTAL MEMORY STORAGE Public/Granted day:2015-10-01
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