Invention Grant
- Patent Title: Power semiconductor device and method of fabricating the same
- Patent Title (中): 功率半导体装置及其制造方法
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Application No.: US13890680Application Date: 2013-05-09
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Publication No.: US09356116B2Publication Date: 2016-05-31
- Inventor: Jaehoon Park , In Hyuk Song , Dong Soo Seo , Kwang Soo Kim , Kee Ju Um
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0020713 20130226
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L27/088 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/768 ; H01L29/78 ; H01L51/05 ; H01L27/08 ; H01L27/092 ; H01L31/111

Abstract:
There is provided a power semiconductor device, including a first conductive type drift layer; a second conductive type body layer formed on the drift layer, a second conductive type collector layer formed below the drift layer; a first gate formed by penetrating through the body layer and a portion of the drift layer, a first conductive type emitter layer formed in the body layer and formed to be spaced apart from the first gate, a second gate covering upper portions of the body layer and the emitter layer and formed as a flat type gate on the first gate, and a segregation stop layer formed between contact surfaces of the first and second gates with the body layer, the emitter layer, and the drift layer.
Public/Granted literature
- US20140239344A1 POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-08-28
Information query
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