Invention Grant
US09409247B2 Joining method, method for producing electronic device and electronic part
有权
接合方法，电子器件和电子部件的制造方法
- Patent Title: Joining method, method for producing electronic device and electronic part
- Patent Title (中): 接合方法，电子器件和电子部件的制造方法
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Application No.: US14460519Application Date: 2014-08-15
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Publication No.: US09409247B2Publication Date: 2016-08-09
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-048025 20120305
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/00 ; B23K1/19 ; B23K35/26 ; C22C9/00 ; C22C9/01 ; C22C13/00 ; C22C13/02 ; H01L21/52 ; C22C9/04 ; B23K35/02 ; B23K1/008 ; H01R4/02 ; H05K13/04 ; B23K35/30 ; B23K35/22 ; H01L23/00 ; H05K3/34
Abstract:
In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.
Public/Granted literature
- US20140345939A1 JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRONIC PART Public/Granted day:2014-11-27
Information query
IPC分类:
