Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
- Patent Title (中): 半导体器件及其制造方法相同
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Application No.: US14520196Application Date: 2014-10-21
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Publication No.: US09431435B2Publication Date: 2016-08-30
- Inventor: Yoshinori Ando , Hidekazu Miyairi , Naoto Yamade , Asako Higa , Miki Suzuki , Yoshinori Ieda , Yasutaka Suzuki , Kosei Nei , Shunpei Yamazaki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2013-219682 20131022
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L21/469 ; C23C14/08 ; C23C14/35 ; H01L29/66 ; H01L21/822 ; H01L27/06

Abstract:
To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
Public/Granted literature
- US20150108475A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2015-04-23
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