Method for manufacturing semiconductor device
    3.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08951899B2

    公开(公告)日:2015-02-10

    申请号:US13681888

    申请日:2012-11-20

    摘要: To provide a semiconductor device including an oxide semiconductor which is capable of having stable electric characteristics and achieving high reliability, by a dehydration or dehydrogenation treatment performed on a base insulating layer provided in contact with an oxide semiconductor layer, the water and hydrogen contents of the base insulating layer can be decreased, and by an oxygen doping treatment subsequently performed, oxygen which can be eliminated together with the water and hydrogen is supplied to the base insulating layer. By formation of the oxide semiconductor layer in contact with the base insulating layer whose water and hydrogen contents are decreased and whose oxygen content is increased, oxygen can be supplied to the oxide semiconductor layer while entry of the water and hydrogen into the oxide semiconductor layer is suppressed.

    摘要翻译: 为了提供一种能够具有稳定的电特性并实现高可靠性的氧化物半导体的半导体器件,通过对与氧化物半导体层接触的基底绝缘层进行脱水或脱氢处理, 可以降低基极绝缘层,并且随后进行氧掺杂处理,可以将与水和氢一起消除的氧气供应到基底绝缘层。 通过形成与水和氢含量降低并且氧含量增加的基极绝缘层接触的氧化物半导体层,在水和氢进入氧化物半导体层的过程中可以向氧化物半导体层提供氧气 被压制

    Method for manufacturing semiconductor device

    公开(公告)号:US09171943B2

    公开(公告)日:2015-10-27

    申请号:US14583338

    申请日:2014-12-26

    摘要: To provide a semiconductor device including an oxide semiconductor which is capable of having stable electric characteristics and achieving high reliability, by a dehydration or dehydrogenation treatment performed on a base insulating layer provided in contact with an oxide semiconductor layer, the water and hydrogen contents of the base insulating layer can be decreased, and by an oxygen doping treatment subsequently performed, oxygen which can be eliminated together with the water and hydrogen is supplied to the base insulating layer. By formation of the oxide semiconductor layer in contact with the base insulating layer whose water and hydrogen contents are decreased and whose oxygen content is increased, oxygen can be supplied to the oxide semiconductor layer while entry of the water and hydrogen into the oxide semiconductor layer is suppressed.

    Semiconductor device and method for manufacturing semiconductor device
    8.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device 有权
    半导体装置及半导体装置的制造方法

    公开(公告)号:US09318577B2

    公开(公告)日:2016-04-19

    申请号:US14284857

    申请日:2014-05-22

    摘要: A semiconductor device is provided, which includes a single crystal semiconductor layer formed over an insulating surface and having a source region, a drain region, and a channel formation region, a gate insulating film covering the single crystal semiconductor layer and a gate electrode overlapping with the channel formation region with the gate insulating film interposed therebetween. In the semiconductor device, at least the drain region of the source and drain regions includes a first impurity region adjacent to the channel formation region and a second impurity region adjacent to the first impurity region. A maximum of an impurity concentration distribution in the first impurity region in a depth direction is closer to the insulating surface than a maximum of an impurity concentration distribution in the second impurity region in a depth direction.

    摘要翻译: 提供了一种半导体器件,其包括形成在绝缘表面上并具有源极区,漏极区和沟道形成区的单晶半导体层,覆盖单晶半导体层的栅极绝缘膜和与 沟道形成区域之间插入栅极绝缘膜。 在半导体器件中,源极和漏极区域的至少漏极区域包括与沟道形成区域相邻的第一杂质区域和与第一杂质区域相邻的第二杂质区域。 与深度方向上的第二杂质区域的杂质浓度分布的最大值相比,深度方向上的第一杂质区域的杂质浓度分布的最大值比绝缘面更接近。