Invention Grant
US09462689B2 Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
有权
环氧树脂组合物和使用环氧树脂组合物的绝缘层的印刷电路板
- Patent Title: Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
- Patent Title (中): 环氧树脂组合物和使用环氧树脂组合物的绝缘层的印刷电路板
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Application No.: US14647721Application Date: 2013-11-22
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Publication No.: US09462689B2Publication Date: 2016-10-04
- Inventor: Geon Young Kil , Myeong Jeong Kim , Jae Man Park , Jong Heum Yoon , Jeung Ook Park , Sung Jin Yun , Jong Sik Lee , Sang A. Ju , Yeo Eun Yoon
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2012-0137965 20121130; KR10-2012-0137996 20121130
- International Application: PCT/KR2013/010688 WO 20131122
- International Announcement: WO2014/084555 WO 20140605
- Main IPC: H05K1/05
- IPC: H05K1/05 ; B32B15/092 ; B32B27/20 ; B32B27/26 ; B32B27/38 ; C08L63/00 ; C08K3/22 ; C08K3/28 ; C08K3/34 ; C08K3/36 ; C08K3/38 ; H05K1/03 ; H01B3/40 ; C08G59/50 ; C08G59/22 ; C08G59/56 ; C09K5/14 ; C08K3/00 ; C08K5/41
Abstract:
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
Public/Granted literature
Information query
