Invention Grant
- Patent Title: Support unit and substrate treating device including the same
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Application No.: US14527606Application Date: 2014-10-29
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Publication No.: US09623503B2Publication Date: 2017-04-18
- Inventor: Wonhaeng Lee , Kangrae Ha
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Priority: KR10-2013-0131350 20131031; KR10-2014-0009050 20140124
- Main IPC: C03C25/68
- IPC: C03C25/68 ; G03B27/58 ; H01L21/683 ; B23K1/00 ; H01L21/67 ; H01L21/687 ; H01J37/32 ; G03F7/20
Abstract:
Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.
Public/Granted literature
- US20150116689A1 SUPPORT UNIT AND SUBSTRATE TREATING DEVICE INCLUDING THE SAME Public/Granted day:2015-04-30
Information query
