公开(公告)号：US20150116689A1

公开(公告)日：2015-04-30

申请号：US14527606

申请日：2014-10-29

Applicant: SEMES CO., LTD.

Inventor： Wonhaeng Lee ,  Kangrae Ha

IPC: G03F7/20 ,  B23K1/00

CPC classification number: B23K1/0016 ,  G03F7/70708 ,  H01J37/32082 ,  H01J37/32715 ,  H01L21/67063 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757

Abstract: Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.

Abstract translation: 提供一种制造支撑基板的支撑单元的方法。 该方法包括：提供由非导电材料形成并支撑基板的支撑板; 提供设置在所述支撑板下方并由包括导电材料的材料形成的基板; 以及在所述支撑板的底部沉积金属层，并通过钎焊将所述金属层和所述基板联接。

公开(公告)号：US09623503B2

公开(公告)日：2017-04-18

申请号：US14527606

申请日：2014-10-29

Applicant: SEMES CO., LTD.

Inventor： Wonhaeng Lee ,  Kangrae Ha

IPC: C03C25/68 ,  G03B27/58 ,  H01L21/683 ,  B23K1/00 ,  H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  G03F7/20

CPC classification number: B23K1/0016 ,  G03F7/70708 ,  H01J37/32082 ,  H01J37/32715 ,  H01L21/67063 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757

Abstract: Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.

公开(公告)号：US09909197B2

公开(公告)日：2018-03-06

申请号：US14974023

申请日：2015-12-18

Applicant: Semes Co., Ltd.

Inventor： Wonhaeng Lee ,  Kang Rae Ha

IPC: B23K31/02 ,  C22C29/12 ,  H02N13/00 ,  B23K35/32 ,  B23K35/28 ,  C22C29/02 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B32B15/00 ,  C22C49/06 ,  C22C49/14

CPC classification number: C22C29/12 ,  B23K35/286 ,  B23K35/325 ,  B32B15/00 ,  C22C29/02 ,  C22C49/06 ,  C22C49/14 ,  H01J37/32568 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68757 ,  H01L21/68785 ,  H02N13/00

Abstract: A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process.