- 专利标题: Ring protocol for low latency interconnect switch
-
申请号: US13994792申请日: 2011-11-29
-
公开(公告)号: US09639490B2公开(公告)日: 2017-05-02
- 发明人: Robert G. Blankenship , Geeyarpuram N. Santhanakrishnan , Yen-Cheng Liu , Bahaa Fahim , Ganapati N. Srinivasa
- 申请人: Robert G. Blankenship , Geeyarpuram N. Santhanakrishnan , Yen-Cheng Liu , Bahaa Fahim , Ganapati N. Srinivasa
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Law Office of R. Alan Burnett, P.S
- 国际申请: PCT/US2011/062311 WO 20111129
- 国际公布: WO2013/081579 WO 20130606
- 主分类号: G06F13/42
- IPC分类号: G06F13/42 ; G06F13/40 ; G06F13/16 ; G06F17/13 ; G06F17/50
摘要:
Methods, systems, and apparatus for implementing low latency interconnect switches between CPU's and associated protocols. CPU's are configured to be installed on a main board including multiple CPU sockets linked in communication via CPU socket-to-socket interconnect links forming a CPU socket-to-socket ring interconnect. The CPU's are also configured to transfer data between one another by sending data via the CPU socket-to-socket interconnects. Data may be transferred using a packetized protocol, such as QPI, and the CPU's may also be configured to support coherent memory transactions across CPU's.
公开/授权文献
- US20150269104A1 RING PROTOCOL FOR LOW LATENCY INTERCONNECT SWITCH 公开/授权日:2015-09-24
信息查询