Invention Grant
- Patent Title: Thin film transistor, manufacturing method thereof and array substrate
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Application No.: US14429059Application Date: 2014-07-25
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Publication No.: US09653284B2Publication Date: 2017-05-16
- Inventor: Zhengliang Li , Zhen Liu , Luke Ding , Bin Zhang , Zhanfeng Cao , Guanbao Hui
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201410032607 20140123
- International Application: PCT/CN2014/083072 WO 20140725
- International Announcement: WO2015/109802 WO 20150730
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L29/00 ; H01L21/02 ; H01L41/08 ; H01L29/49 ; H01L29/786 ; C22C9/00 ; H01L21/28

Abstract:
A thin film transistor, a manufacturing method thereof and an array substrate are provided. The thin film transistor comprises: a gate electrode (11), a source electrode (15) and a drain electrode (16), and the thin film transistor further comprises a buffer layer (11) which is directly provided at one side or both sides of at least one of the gate electrode (11), the source electrode (15) and the drain electrode (16), wherein, the buffer layer (11) and at least one of the gate electrode (11), the source electrode (15) and the drain electrode (16) directly contacting the buffer layer (11) are conformal. Therefore, the adhesion between an electrode of the thin film transistor and a film layer contacting it is improved and at the same time an atom in the electrode of the thin film transistor is effectively prevented from diffusing to the film layer connected with it, and the reliability of the thin film transistor is improved and the production cost is reduced.
Public/Granted literature
- US20160027927A1 THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND ARRAY SUBSTRATE Public/Granted day:2016-01-28
Information query
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