- Patent Title: Thermally-aware throttling in a three-dimensional processor stack
-
Application No.: US14862044Application Date: 2015-09-22
-
Publication No.: US09658663B2Publication Date: 2017-05-23
- Inventor: Wei Huang , Manish Arora , Yasuko Eckert , Indrani Paul
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: G06F1/28
- IPC: G06F1/28 ; G06F1/30 ; G06F1/20 ; G06T1/20 ; G06F1/32 ; G06F11/30

Abstract:
A three-dimensional (3-D) processor stack includes a plurality of processor cores implemented in a plurality of layers. A controller is to selectively throttle one or more of a plurality of processor cores in response to detecting a thermal event. The controller selectively throttles the one or more of the plurality of processor cores based on values of thermal couplings between the plurality of layers and based on measures of criticality of threads executing on the plurality of processor cores.
Public/Granted literature
- US20170083065A1 THERMALLY-AWARE THROTTLING IN A THREE-DIMENSIONAL PROCESSOR STACK Public/Granted day:2017-03-23
Information query