Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
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Application No.: US14530589Application Date: 2014-10-31
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Publication No.: US09687957B2Publication Date: 2017-06-27
- Inventor: Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2008-147220 20080604; JP2008-190834 20080724; JP2009-108671 20090428
- Main IPC: B24B37/34
- IPC: B24B37/34 ; H01L21/677 ; H01L21/67 ; H01L21/306
Abstract:
An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
Public/Granted literature
Information query
