公开(公告)号：US12205831B2

公开(公告)日：2025-01-21

申请号：US18444981

申请日：2024-02-19

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Koichi Fukaya ,  Fumitoshi Oikawa ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/32 ,  B08B3/02 ,  B24B7/22 ,  H01L21/687

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

公开(公告)号：US11846536B2

公开(公告)日：2023-12-19

申请号：US16532493

申请日：2019-08-06

Applicant: EBARA CORPORATION

Inventor： Naoki Toyomura ,  Mitsuru Miyazaki

IPC: G01F23/292 ,  B24B37/34 ,  B08B3/02 ,  B08B3/04 ,  B24B37/005

CPC classification number: G01F23/2921 ,  B08B3/02 ,  B08B3/04 ,  B24B37/005 ,  B24B37/34

Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

公开(公告)号：US10575697B2

公开(公告)日：2020-03-03

申请号：US15946607

申请日：2018-04-05

Applicant: EBARA CORPORATION

Inventor： Akira Imamura ,  Junji Kunisawa ,  Mitsuru Miyazaki

IPC: B08B11/02 ,  H01L21/67 ,  A47L11/18 ,  B24B29/00 ,  G05D3/20 ,  G01C1/00 ,  B24B37/34 ,  B24B7/22 ,  B24B27/00 ,  B24B53/017 ,  B24B37/10 ,  B08B11/00

Abstract: Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.

公开(公告)号：US10438818B2

公开(公告)日：2019-10-08

申请号：US15128309

申请日：2015-03-17

Applicant: EBARA CORPORATION

Inventor： Junji Kunisawa ,  Toru Maruyama ,  Masayoshi Imai ,  Koji Maeda ,  Mitsuru Miyazaki ,  Teruaki Hombo ,  Fujihiko Toyomasu

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B9/027 ,  H01L21/02

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.

公开(公告)号：US10121692B2

公开(公告)日：2018-11-06

申请号：US14935893

申请日：2015-11-09

Applicant: Ebara Corporation

Inventor： Naoki Toyomura ,  Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/687 ,  B25B5/00 ,  B25B5/14

Abstract: There is disclosed an improved substrate holding apparatus which can minimize deformation of a spring, which is provided to bias a support post for supporting a substrate, even when a large centrifugal force acts on the spring. The substrate holding apparatus includes: a support post movable in an axial direction thereof; a chuck provided on the support post and configured to hold a periphery of a substrate; a spring biasing the support post in the axial direction; a first structure configured to restrict a movement of an upper portion of the spring in a direction perpendicular to the axial direction of the support post; and a second structure configured to restrict a movement of a lower portion of the spring in a direction perpendicular to the axial direction of the support post.

公开(公告)号：US10032655B2

公开(公告)日：2018-07-24

申请号：US14334394

申请日：2014-07-17

Applicant: EBARA CORPORATION

Inventor： Takeshi Sakurai ,  Eiji Hirai ,  Kaoru Hamaura ,  Mitsuru Miyazaki ,  Koji Maruyama

IPC: H01L21/67 ,  B08B1/00

Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

公开(公告)号：US12094754B2

公开(公告)日：2024-09-17

申请号：US16823448

申请日：2020-03-19

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/687 ,  H02K11/24

CPC classification number: H01L21/68764 ,  H01L21/68728 ,  H02K11/24

Abstract: Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.

公开(公告)号：US12053851B2

公开(公告)日：2024-08-06

申请号：US16454719

申请日：2019-06-27

Applicant: EBARA CORPORATION

Inventor： Lien Yin Cheng ,  Akira Imamura ,  Mitsuru Miyazaki ,  Junji Kunisawa

IPC: B24B29/02 ,  B08B1/32 ,  B08B1/50 ,  H01L21/67

CPC classification number: B24B29/02 ,  B08B1/32 ,  B08B1/50 ,  H01L21/67046 ,  H01L21/67051

Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

公开(公告)号：US11967508B2

公开(公告)日：2024-04-23

申请号：US17607999

申请日：2020-05-29

Applicant: EBARA CORPORATION

Inventor： Akira Imamura ,  Mitsuru Miyazaki ,  Junji Kunisawa

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67034 ,  H01L21/6704 ,  H01L21/67253 ,  H01L21/67742

Abstract: The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system (300) includes an exhaust damper (310), a first pressure sensor (311), and a controller (315) configured to control an opening degree of the exhaust damper (310). The controller (315) is configured to switch the opening degree of the exhaust damper (310) to an opening degree smaller than a full opening on condition that a shutter (217) is opened.

公开(公告)号：US11948827B2

公开(公告)日：2024-04-02

申请号：US17838248

申请日：2022-06-12

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Hisajiro Nakano ,  Takuya Inoue

IPC: H01L21/687 ,  B08B3/02 ,  B08B13/00 ,  H01L21/67

CPC classification number: H01L21/68728 ,  B08B3/022 ,  B08B13/00 ,  H01L21/67028

Abstract: The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.