公开(公告)号：US09687957B2

公开(公告)日：2017-06-27

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US11260493B2

公开(公告)日：2022-03-01

申请号：US16245989

申请日：2019-01-11

Applicant: EBARA CORPORATION

Inventor： Minoru Harada ,  Takahiro Nanjo ,  Hiroyuki Takenaka ,  Naoki Matsuda

IPC: B24B21/00 ,  B24B21/20 ,  B24B49/16 ,  B24B9/06 ,  B24B49/00

Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.

公开(公告)号：US20200047309A1

公开(公告)日：2020-02-13

申请号：US16657901

申请日：2019-10-18

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US09144881B2

公开(公告)日：2015-09-29

申请号：US14187778

申请日：2014-02-24

Applicant: EBARA CORPORATION

Inventor： Hidetaka Nakao ,  Soichi Isobe ,  Seiji Katsuoka ,  Naoki Matsuda

IPC: B24B37/34 ,  H01L21/67 ,  B24B9/06

CPC classification number: B24B37/345 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract translation: 抛光装置包括：周边部分抛光单元，被配置为抛光基板的周边部分; CMP单元，被配置为抛光基板W的平坦表面;清洁单元，被配置为清洁抛光的基板;传送系统， 底物。 运送系统将在周边部分抛光单元和CMP单元之一中抛光的基板传送到清洁单元，并将清洁单元中已经清洁的基板输送到周边部分抛光单元中的另一个 和CMP单元。

公开(公告)号：US20140197610A1

公开(公告)日：2014-07-17

申请号：US14150257

申请日：2014-01-08

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Naoki Matsuda ,  Junji Kunisawa ,  Manao Hoshina

IPC: H01L21/687

CPC classification number: H01L21/68728 ,  H01L21/68742 ,  H01L21/68785 ,  Y10T279/26

Abstract: The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

Abstract translation: 本发明涉及一种基板夹持装置，其包括基座，可相对于基座垂直移动的多个支撑柱，构造成提升支撑柱的提升机构，以及安装到每个支撑柱上的基板保持器和基板引导构件 支持岗位。 每个支撑柱包括相对运动机构，该相对运动机构构造成当支撑柱向上移动时，使衬底保持器沿衬底保持器释放衬底的周边部分的方向移动，同时使衬底引导构件相对于衬底保持器升高 并且当支撑柱向下移动时，使衬底保持器沿衬底保持器夹持衬底的周边部分的方向移动，同时相对于衬底保持器降低衬底引导构件。

公开(公告)号：US20190217438A1

公开(公告)日：2019-07-18

申请号：US16245989

申请日：2019-01-11

Applicant: EBARA CORPORATION

Inventor： Minoru Harada ,  Takahiro Nanjo ,  Hiroyuki Takenaka ,  Naoki Matsuda

IPC: B24B21/00 ,  B24B49/00

CPC classification number: B24B21/004 ,  B24B9/065 ,  B24B21/002 ,  B24B21/20 ,  B24B49/006

Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.

公开(公告)号：US09892953B2

公开(公告)日：2018-02-13

申请号：US14995952

申请日：2016-01-14

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Naoki Matsuda ,  Junji Kunisawa ,  Manao Hoshina

IPC: B25B11/00 ,  H01L21/687

CPC classification number: H01L21/68728 ,  H01L21/68742 ,  H01L21/68785 ,  Y10T279/26

Abstract: The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

公开(公告)号：US09358662B2

公开(公告)日：2016-06-07

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: H01L21/67 ,  H01L21/306 ,  B24B37/34 ,  H01L21/677

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US20160133503A1

公开(公告)日：2016-05-12

申请号：US14995952

申请日：2016-01-14

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Naoki Matsuda ,  Junji Kunisawa ,  Manao Hoshina

IPC: H01L21/687

CPC classification number: H01L21/68728 ,  H01L21/68742 ,  H01L21/68785 ,  Y10T279/26

Abstract: The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

Abstract translation: 本发明涉及一种基板夹持装置，其包括基座，可相对于基座垂直移动的多个支撑柱，构造成提升支撑柱的提升机构，以及安装到每个支撑柱上的基板保持器和基板引导构件 支持岗位。 每个支撑柱包括相对运动机构，该相对运动机构构造成当支撑柱向上移动时，使衬底保持器沿衬底保持器释放衬底的周边部分的方向移动，同时使衬底引导构件相对于衬底保持器升高 并且当支撑柱向下移动时，使衬底保持器沿衬底保持器夹持衬底的周边部分的方向移动，同时相对于衬底保持器降低衬底引导构件。

公开(公告)号：US09269605B2

公开(公告)日：2016-02-23

申请号：US14150257

申请日：2014-01-08

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Naoki Matsuda ,  Junji Kunisawa ,  Manao Hoshina

IPC: H01L21/687

CPC classification number: H01L21/68728 ,  H01L21/68742 ,  H01L21/68785 ,  Y10T279/26

Abstract: The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

Abstract translation: 本发明涉及一种基板夹持装置，其包括基座，可相对于基座垂直移动的多个支撑柱，构造成提升支撑柱的提升机构，以及安装到每个支撑柱上的基板保持器和基板引导构件 支持岗位。 每个支撑柱包括相对运动机构，该相对运动机构构造成当支撑柱向上移动时，使衬底保持器沿衬底保持器释放衬底的周边部分的方向移动，同时使衬底引导构件相对于衬底保持器升高 并且当支撑柱向下移动时，使衬底保持器沿衬底保持器夹持衬底的周边部分的方向移动，同时相对于衬底保持器降低衬底引导构件。