公开(公告)号：US11890716B2

公开(公告)日：2024-02-06

申请号：US17117723

申请日：2020-12-10

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Kenichi Kobayashi ,  Asagi Matsugu

IPC: B24B37/005 ,  B24B37/04 ,  B24B49/12

CPC classification number: B24B37/0053 ,  B24B37/04 ,  B24B49/12

Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

公开(公告)号：USD890825S1

公开(公告)日：2020-07-21

申请号：US29676944

申请日：2019-01-16

Applicant: EBARA CORPORATION

Designer： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

公开(公告)号：US10651057B2

公开(公告)日：2020-05-12

申请号：US15583327

申请日：2017-05-01

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Yu Ishii ,  Keisuke Uchiyama

IPC: H01L21/02 ,  H01L21/67 ,  B08B1/00 ,  H01L21/304 ,  B08B3/04 ,  B08B1/04

Abstract: An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

公开(公告)号：US20200047309A1

公开(公告)日：2020-02-13

申请号：US16657901

申请日：2019-10-18

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US12138734B2

公开(公告)日：2024-11-12

申请号：US18297469

申请日：2023-04-07

Applicant: Ebara Corporation

Inventor： Tetsuji Togawa ,  Kenichi Kobayashi

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/306

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

公开(公告)号：US20200316747A1

公开(公告)日：2020-10-08

申请号：US16825799

申请日：2020-03-20

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/32 ,  B24B37/005

Abstract: An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

公开(公告)号：US20200306924A1

公开(公告)日：2020-10-01

申请号：US16821281

申请日：2020-03-17

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Makoto Kashiwagi

IPC: B24B37/32

Abstract: To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.

公开(公告)号：US10403505B2

公开(公告)日：2019-09-03

申请号：US15701206

申请日：2017-09-11

Applicant: EBARA CORPORATION

Inventor： Kenya Ito ,  Masaya Seki ,  Kenichi Kobayashi ,  Michiyoshi Yamashita

IPC: H01L21/304 ,  B23K26/08 ,  B24B37/00 ,  H01L21/02 ,  H01L21/67 ,  B24B21/00 ,  B24B21/08 ,  B24B9/06 ,  B23K101/40

Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

公开(公告)号：US10354900B2

公开(公告)日：2019-07-16

申请号：US15356869

申请日：2016-11-21

Applicant: Ebara Corporation

Inventor： Akihiro Yazawa ,  Kenichi Kobayashi ,  Takahiro Nanjo ,  Hiroyuki Takenaka

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.

公开(公告)号：US09687957B2

公开(公告)日：2017-06-27

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.