公开(公告)号：US11426834B2

公开(公告)日：2022-08-30

申请号：US16657901

申请日：2019-10-18

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: H01L21/67 ,  B24B37/34 ,  H01L21/677 ,  H01L21/306

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US09687957B2

公开(公告)日：2017-06-27

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US09358662B2

公开(公告)日：2016-06-07

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: H01L21/67 ,  H01L21/306 ,  B24B37/34 ,  H01L21/677

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US20200047309A1

公开(公告)日：2020-02-13

申请号：US16657901

申请日：2019-10-18

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67 ,  H01L21/306

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.