Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US14832767Application Date: 2015-08-21
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Publication No.: US09700988B2Publication Date: 2017-07-11
- Inventor: Kuniaki Yamaguchi , Itsuki Kobata , Toshio Mizuno , Mitsuru Miyazaki , Naoki Toyomura , Takuya Inoue
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2014-171837 20140826; JP2014-171841 20140826; JP2014-185489 20140911; JP2014-185508 20140911; JP2014-195584 20140925; JP2014-257563 20141219
- Main IPC: B24B53/00
- IPC: B24B53/00 ; B24B53/017 ; B08B3/02 ; B08B1/04 ; H01L21/67

Abstract:
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
Public/Granted literature
- US20160059380A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-03-03
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