公开(公告)号：US12046500B2

公开(公告)日：2024-07-23

申请号：US17832677

申请日：2022-06-05

Applicant: EBARA CORPORATION

Inventor： Hao Yu ,  Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/677 ,  C23C16/455 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67742 ,  C23C16/45519 ,  H01L21/67034 ,  H01L21/67219 ,  H01L21/68764

Abstract: A transport apparatus includes a hand, a drive mechanism, a cover member, and a gas supply member. The hand is configured to hold a wafer. The drive mechanism is configured to transport the wafer by moving the hand. The cover member has an opposing surface opposed to a surface of the wafer held by the hand and is formed with a plurality of holes opened in the opposing surface. The gas supply member is configured to supply an inert gas to the surface of the wafer via the plurality of holes of the cover member. The plurality of holes are formed in the opposing surface so that an opening ratio of an outer peripheral portion of the opposing surface is higher than an opening ratio of a central portion of the opposing surface.

公开(公告)号：US11195736B2

公开(公告)日：2021-12-07

申请号：US15372033

申请日：2016-12-07

Applicant: EBARA CORPORATION

Inventor： Naoki Toyomura ,  Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: An object of the present invention is to detach a substrate from a table without damaging the substrate by lift pins.
One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin. The lift pins are stoppable in a lower end position where the substrate guide surface of each of the lift pins is disposed below a suction-holding surface of the vacuum suction table, an upper end position where the substrate holding surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and an intermediate position between the lower end position and the upper end position. In the intermediate position, the substrate guide surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and the substrate holding surface of each of the lift pins is disposed below the suction-holding surface of the vacuum suction table.

公开(公告)号：USD735429S1

公开(公告)日：2015-07-28

申请号：US29485703

申请日：2014-03-21

Applicant: EBARA CORPORATION

Designer： Mitsuru Miyazaki ,  Takuya Inoue

公开(公告)号：US12205831B2

公开(公告)日：2025-01-21

申请号：US18444981

申请日：2024-02-19

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Koichi Fukaya ,  Fumitoshi Oikawa ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/32 ,  B08B3/02 ,  B24B7/22 ,  H01L21/687

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

公开(公告)号：US10121692B2

公开(公告)日：2018-11-06

申请号：US14935893

申请日：2015-11-09

Applicant: Ebara Corporation

Inventor： Naoki Toyomura ,  Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/687 ,  B25B5/00 ,  B25B5/14

Abstract: There is disclosed an improved substrate holding apparatus which can minimize deformation of a spring, which is provided to bias a support post for supporting a substrate, even when a large centrifugal force acts on the spring. The substrate holding apparatus includes: a support post movable in an axial direction thereof; a chuck provided on the support post and configured to hold a periphery of a substrate; a spring biasing the support post in the axial direction; a first structure configured to restrict a movement of an upper portion of the spring in a direction perpendicular to the axial direction of the support post; and a second structure configured to restrict a movement of a lower portion of the spring in a direction perpendicular to the axial direction of the support post.

公开(公告)号：US11894244B2

公开(公告)日：2024-02-06

申请号：US17336627

申请日：2021-06-02

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/02

CPC classification number: H01L21/67046 ,  B08B1/002 ,  B08B1/02

Abstract: A cleaning member mounting mechanism has: a cleaning member holding part, to which a cleaning member assembly having a cleaning member for cleaning a substrate W can be mounted; a member rotation part for rotating the cleaning member assembly held by the cleaning member holding part; and a moving part which moves the cleaning member holding part along an axial direction when the cleaning member assembly is removed, thereby to bring the cleaning member holding part into a rotation fixed position to restrict a rotation of the cleaning member holding part.

公开(公告)号：USD992845S1

公开(公告)日：2023-07-18

申请号：US29758287

申请日：2020-11-13

Applicant: EBARA CORPORATION

Designer： Tomoaki Fujimoto ,  Mitsuru Miyazaki ,  Takuya Inoue

Abstract: FIG. 1 is a left side view of a roller shaft for substrate cleaning showing our new design;
FIG. 2 is a right side view thereof;
FIG. 3 is a front view thereof, including a detail view of a portion thereof;
FIG. 4 is a top view thereof, including a detail view of a portion thereof;
FIG. 5 is a cross-section view thereof, taken along the line 5-5 of FIG. 1;
FIG. 6 is an enlarged top perspective view; and,
FIG. 7 is an enlarged left side view thereof.
The broken lines in the figures show portions of the roller shaft that form no part of the claimed design.

公开(公告)号：US11090692B2

公开(公告)日：2021-08-17

申请号：US16373004

申请日：2019-04-02

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Akira Imamura ,  Takuya Inoue ,  Shozo Takahashi

IPC: B08B3/04 ,  H01L21/67 ,  G05D16/20

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

公开(公告)号：US20140373289A1

公开(公告)日：2014-12-25

申请号：US14309287

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate.

Abstract translation: 公开了能够减少诸如晶片的基板的偏转量的基板保持装置。 基板保持装置包括：多个卡盘，其构造成保持基板的周边边缘; 设置在所述基板下方的至少一个支撑构件; 以及致动装置，其构造成使得所述卡盘与所述基板的周边边缘接触，同时升高所述支撑构件以使所述支撑构件与所述基板的下表面接触，并且构造成使所述卡盘沿远离所述基板的方向移动 同时降低支撑构件以将支撑构件分离离开衬底的下表面。

公开(公告)号：US11948811B2

公开(公告)日：2024-04-02

申请号：US17128643

申请日：2020-12-21

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Tomoaki Fujimoto ,  Koichi Fukaya ,  Fumitoshi Oikawa ,  Takuya Inoue

IPC: H01L21/67 ,  B08B1/04 ,  B08B3/02 ,  B24B7/22 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B1/04 ,  B08B3/024 ,  B24B7/228 ,  H01L21/67046 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68764

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.