Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US14141547Application Date: 2013-12-27
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Publication No.: US09728666B2Publication Date: 2017-08-08
- Inventor: Bongjin Kuh , Kichul Kim , JeongMeung Kim , Joonghan Shin , Jongsung Lim , Hanmei Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0063293 20130603
- Main IPC: H01L31/0248
- IPC: H01L31/0248 ; H01L31/105 ; H01L31/0224 ; H01L31/0232 ; H01L31/0352 ; H01L31/18

Abstract:
A semiconductor device includes a substrate, a first insulation layer formed on the substrate in a first region, a photon absorption seed layer formed on the first insulation layer in the first region and on the substrate in a second region separate from the first region, and a photon absorption layer formed on the photon absorption seed layer in the first region. The photon absorption seed layer has a particular structure that may assist in reducing dislocation density in a region that includes a photon absorption layer.
Public/Granted literature
- US20140353713A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-12-04
Information query
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