Invention Grant
- Patent Title: Tungsten-processing slurry with cationic surfactant and cyclodextrin
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Application No.: US14924997Application Date: 2015-10-28
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Publication No.: US09771496B2Publication Date: 2017-09-26
- Inventor: Kevin Dockery , Helin Huang , Lin Fu , Tina Li
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Daniel C. Schulte
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/24 ; C23F3/04
Abstract:
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.
Public/Granted literature
- US20170121560A1 TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT AND CYCLODEXTRIN Public/Granted day:2017-05-04
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