Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
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Application No.: US15223002Application Date: 2016-07-29
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Publication No.: US09780201B2Publication Date: 2017-10-03
- Inventor: Yoshinori Ando , Hidekazu Miyairi , Naoto Yamade , Asako Higa , Miki Suzuki , Yoshinori Ieda , Yasutaka Suzuki , Kosei Nei , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2013-219682 20131022
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/477 ; H01L29/66 ; C23C14/08 ; C23C14/35 ; H01L21/469 ; H01L21/4757 ; H01L21/822 ; H01L27/06 ; H01L27/088 ; H01L27/12 ; H01L29/786

Abstract:
To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
Public/Granted literature
- US20160336433A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2016-11-17
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