Invention Grant
- Patent Title: Laser welding of transparent and opaque materials
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Application No.: US14230324Application Date: 2014-03-31
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Publication No.: US09787345B2Publication Date: 2017-10-10
- Inventor: Logan M. Ames , Michael M. Li
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: B23K26/21
- IPC: B23K26/21 ; B23K26/24 ; B23K26/32 ; B23K103/18 ; B32B3/24 ; B32B7/02 ; B32B7/04 ; B32B3/02 ; B32B37/06 ; B32B38/00 ; H04B1/3888 ; H04M1/725 ; H05K5/00 ; B23K26/00 ; B32B37/14 ; B32B37/18 ; B32B37/12 ; B23K26/57 ; B23K26/10 ; B23K26/26 ; B23K26/40 ; H05K5/03 ; B29C65/16 ; B29C65/00 ; B32B3/26 ; B23K26/60 ; B23K103/00 ; B23K103/08 ; B23K26/324 ; B23K101/36 ; B32B7/00 ; H04M1/02 ; G06F1/16 ; B29L31/34 ; H05K5/06 ; H05K5/04
Abstract:
Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.
Public/Granted literature
- US20150280767A1 LASER WELDING OF TRANSPARENT AND OPAQUE MATERIALS Public/Granted day:2015-10-01
Information query
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