- Patent Title: Embedding additive particles in encapsulant of electronic device
-
Application No.: US14835750Application Date: 2015-08-26
-
Publication No.: US09852918B2Publication Date: 2017-12-26
- Inventor: Peh Hean Teh , Jagen Krishnan , Swee Kah Lee , Poh Cheng Lim , Joachim Mahler , Chew Theng Tai , Yik Yee Tan , Soon Lock Goh
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102014112406 20140828
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/3105 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; C09J163/00

Abstract:
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Public/Granted literature
- US20160064298A1 Embedding additive particles in encapsulant of electronic device Public/Granted day:2016-03-03
Information query
IPC分类: