Invention Grant
- Patent Title: Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuck
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Application No.: US15065914Application Date: 2016-03-10
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Publication No.: US09862037B2Publication Date: 2018-01-09
- Inventor: Ingo Muri , Alexander Binter , Bernhard Goller , Christian Grindling
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentshura & PartnermbB
- Main IPC: B23C3/13
- IPC: B23C3/13 ; B23Q3/08 ; H01L21/683 ; H01L21/67 ; H01L21/304
Abstract:
According to various embodiments, a workpiece planarization arrangement may include: a chuck including a support carrier; and a workpiece-support replaceably mounted on the support carrier; and a planarization tool configured to planarize the at least one portion of the workpiece-support and to planarize one or more workpieces on the at least one portion of the workpiece-support.
Public/Granted literature
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