Invention Grant
- Patent Title: High performance interconnect physical layer
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Application No.: US15237291Application Date: 2016-08-15
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Publication No.: US09916266B2Publication Date: 2018-03-13
- Inventor: Venkatraman Iyer , Darren S. Jue , Robert G. Blankenship , Fulvio Spagna , Ashish Gupta
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F12/08 ; G06F13/22 ; G06F13/42 ; G06F1/32
Abstract:
Re-initialization of a link can take place without termination of the link, where the link includes, a transmitter and a receiver are to be coupled to each lane in the number of lanes, and re-initialization of the link is to include transmission of a pre-defined sequence on each of the lanes.
Public/Granted literature
- US20170097907A1 HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER Public/Granted day:2017-04-06
Information query
