Invention Grant
- Patent Title: NVM memory HKMG integration technology
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Application No.: US15205221Application Date: 2016-07-08
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Publication No.: US09947676B2Publication Date: 2018-04-17
- Inventor: Wei Cheng Wu , Chien-Hung Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/28 ; H01L21/3213 ; H01L21/3105 ; H01L29/66 ; H01L29/423 ; H01L29/788 ; H01L27/11521 ; H01L27/11526

Abstract:
The present disclosure relates to an integrated circuit (IC) that includes a HKMG hybrid non-volatile memory (NVM) device and that provides small scale and high performance, and a method of formation. In some embodiments, the integrated circuit includes a memory region having a NVM device with a pair of control gate electrodes separated from a substrate by corresponding floating gates. A pair of select gate electrodes are disposed at opposite sides of the pair of control gate electrodes. A logic region is disposed adjacent to the memory region and has a logic device with a metal gate electrode disposed over a logic gate dielectric and having bottom and sidewall surfaces covered by a high-k gate dielectric layer. The select gate electrodes or the control gate electrodes comprise metal and have bottom and sidewall surfaces covered by the high-k gate dielectric layer.
Public/Granted literature
- US20180012898A1 NVM MEMORY HKMG INTEGRATION TECHNOLOGY Public/Granted day:2018-01-11
Information query
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