Invention Grant
- Patent Title: Light emitting device package
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Application No.: US15802493Application Date: 2017-11-03
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Publication No.: US09966369B2Publication Date: 2018-05-08
- Inventor: Yong Il Kim , Wan Tae Lim , Young Jin Choi , Sung Hyun Sim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0059941 20160517
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L27/12 ; H01L33/50 ; H01L33/32 ; H01L33/54 ; H01L33/06

Abstract:
A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.
Public/Granted literature
- US20180068991A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2018-03-08
Information query
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