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    Light emitting device package and display apparatus using the same
    2.
    发明授权
    Light emitting device package and display apparatus using the same 有权

    公开(公告)号：US11296260B2

    公开(公告)日：2022-04-05

    申请号：US16438948

    申请日：2019-06-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jin Sub Lee ,  Deuk Seok Chung ,  Hye Seok Noh ,  Young Jin Choi

    IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L27/15 ,  H01L25/075 ,  H01L33/32

    Abstract: A light emitting device package including a partition structure having first and second surfaces, and first to third light emission windows penetrating through the first and second surfaces, a cell array including first to third light emitting devices on the first surface of the partition structure and overlapping the first to third light emission windows, each of the first to third light emitting devices including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, first and second wavelength conversion portions filling interiors of the first and second light emission windows, and having a meniscus-shaped interfaces, a first encapsulating portion including a light-transmissive organic film layer that fills the third light emission window and covers the first and second wavelength conversion portions, and a second encapsulating portion covering the first and second encapsulating portions and including a light-transmissive inorganic film layer.

    Light emitting device package
    4.
    发明授权
    Light emitting device package 有权

    公开(公告)号：US09966369B2

    公开(公告)日：2018-05-08

    申请号：US15802493

    申请日：2017-11-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

    IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/32 ,  H01L33/54 ,  H01L33/06

    CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    Nanostructure semiconductor light-emitting device
    5.
    发明授权
    Nanostructure semiconductor light-emitting device 有权
    纳米结构半导体发光器件

    公开(公告)号：US09461199B2

    公开(公告)日：2016-10-04

    申请号：US14752814

    申请日：2015-06-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Hyeok Heo ,  Jung Sub Kim ,  Young Jin Choi ,  Jin Sub Lee ,  Sam Mook Kang ,  Yeon Woo Seo ,  Han Kyu Seong ,  Dae Myung Chun

    IPC: H01L31/00 ,  H01L33/06 ,  H01L27/15 ,  H01L33/32 ,  H01L33/62 ,  H01L33/24 ,  H01L33/00 ,  H05B33/08

    CPC classification number: H01L33/06 ,  H01L27/153 ,  H01L33/0025 ,  H01L33/08 ,  H01L33/18 ,  H01L33/24 ,  H01L33/32 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0803 ,  H01L2924/00014

    Abstract: There is provided a nanostructure semiconductor light-emitting device including a base layer formed of a first conductivity-type semiconductor, an insulating layer disposed on the base layer and having a plurality of openings, and a plurality of light-emitting nanostructures disposed the plurality of openings, respectively. Each of light-emitting nanostructures includes a nanocore formed of a first conductivity-type semiconductor, and an active layer and a second conductivity-type semiconductor layer sequentially disposed on a surface of the nanocore. The plurality of light-emitting nanostructures are formed through the same growth process and divided into n groups (where n is an integer of two or more), each of which having at least two light-emitting nanostructures. At least one of a diameter, a height, and a pitch of the nanocores is different by group so that the active layers emit light having different wavelengths by group.

    Abstract translation: 提供了一种纳米结构半导体发光器件，其包括由第一导电型半导体形成的基极层，设置在基底层上并具有多个开口的绝缘层，以及多个发光纳米结构， 开口。 每个发光纳米结构包括由第一导电型半导体形成的纳米孔，以及依次设置在纳米孔表面上的有源层和第二导电型半导体层。 多个发光纳米结构通过相同的生长工艺形成，并分成n组（其中n为2以上的整数），每组具有至少两个发光纳米结构。 纳米孔的直径，高度和间距中的至少一个是不同的，使得有源层通过组发射具有不同波长的光。

    Method of manufacturing light emitting device
    7.
    发明授权
    Method of manufacturing light emitting device 有权

    公开(公告)号：US10714667B2

    公开(公告)日：2020-07-14

    申请号：US16020071

    申请日：2018-06-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hye Seok Noh ,  Young Jin Choi ,  Yong Il Kim ,  Han Kyu Seong ,  Dong Gun Lee ,  Jin Sub Lee

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/50 ,  H04N5/225 ,  H01L33/26 ,  H01L33/56 ,  H01L27/15 ,  H01L33/40 ,  H01L25/075

    Abstract: A method of manufacturing a light emitting device includes forming light emitting devices on a support portion, each of the light emitting devices including first to third light emitting cells respectively emitting light of different colors; supplying test power to at least a portion of the light emitting devices using a multi-probe; acquiring an image from the light emitted from the portion of the light emitting devices to which the test power is supplied using an image sensor; identifying normal light emitting devices of the portion of the light emitting devices by determining whether a defect is present in each of the light emitting devices of the portion of the light emitting devices by comparing the image acquired by the image sensor with a reference image; and based on the identifying step, measuring optical characteristics of each of the light emitting devices identified as normal of the portion of the light emitting devices.

    Light emitting device
    8.
    发明授权
    Light emitting device 有权

    公开(公告)号：US10573628B2

    公开(公告)日：2020-02-25

    申请号：US15971196

    申请日：2018-05-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

    IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/54 ,  H01L33/06 ,  H01L33/32

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    Light emitting device package
    9.
    发明授权
    Light emitting device package 有权

    公开(公告)号：US09825016B1

    公开(公告)日：2017-11-21

    申请号：US15386425

    申请日：2016-12-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

    IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/54 ,  H01L33/06 ,  H01L33/32

    CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

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