Invention Grant
- Patent Title: Method of bonding with silver paste
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Application No.: US14800613Application Date: 2015-07-15
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Publication No.: US09972597B2Publication Date: 2018-05-15
- Inventor: Kyoung-Kook Hong , Hyun Woo Noh , Youngkyun Jung , Dae Hwan Chun , Jong Seok Lee , Su Bin Kang
- Applicant: HYUNDAI MOTOR COMPANY
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY
- Current Assignee: HYUNDAI MOTOR COMPANY
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0158778 20141114
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K35/00 ; H01L23/00 ; B23K35/02 ; B23K35/26 ; B23K35/30 ; B23K20/02 ; B23K20/16 ; B23K20/233 ; H05K3/34 ; B23K101/42 ; B23K103/16

Abstract:
A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer.
Public/Granted literature
- US20160141266A1 METHOD OF BONDING WITH SILVER PASTE Public/Granted day:2016-05-19
Information query
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