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公开(公告)号：US20180350714A1
公开(公告)日：2018-12-06
申请号：US16038837
申请日：2018-07-18
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Young Seok Kim , Hyun Woo Noh , Kyoung Kook Hong , Su Bin Kang
IPC: H01L23/367 , H01L23/00 , H01L23/492 , H01L23/495
CPC classification number: H01L23/3675 , H01L23/367 , H01L23/492 , H01L23/49537 , H01L23/49541 , H01L24/33 , H01L24/40 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/33181 , H01L2224/371 , H01L2224/8385 , H01L2224/8485 , H01L2924/17747 , H01L2924/00014
Abstract: A power module capable of increasing structural stability and reliability at high temperatures includes: an upper substrate having a metal layer; a lower substrate spaced apart from the upper substrate and having a metal layer facing the metal layer of the upper substrate; a semiconductor element configured to be disposed between the upper substrate and the lower substrate; and at least one leg portion formed on at least one of the metal layer of the upper substrate and the metal layer of the lower substrate to make the upper substrate and the lower substrate be spaced apart from each other at a predetermined interval, in which the leg portion may be electrically connect the semiconductor element to the metal layer of the upper substrate or the metal layer of the lower substrate.
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公开(公告)号：US11411524B2
公开(公告)日：2022-08-09
申请号：US17122534
申请日：2020-12-15
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Tae II Yoo , Jae Hyeon Lee , Seong Min Kim , Hyun Woo Noh , Han Hee Park , Ji Wan Cha
Abstract: A power conversion system includes an inverter having a three-phase circuit including a plurality of power semiconductor devices and configured to supply driving power to a motor according to an applied torque command, and a controller configured to predict a maximum temperature of the inverter based on an actual measured temperature of any one of the plurality of power semiconductor devices and phase current of the motor, and to actively limit the torque command depending on the predicted maximum temperature of the inverter.
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3.发明授权公开(公告)号：US10249732B1
公开(公告)日：2019-04-02
申请号：US15823856
申请日：2017-11-28
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Youngkyun Jung , NackYong Joo , Junghee Park , Hyun Woo Noh , JongSeok Lee , Dae Hwan Chun
IPC: H01L21/76 , H01L29/66 , H01L21/308 , H01L21/3065 , H01L29/423
Abstract: A manufacturing method of a semiconductor device is provided. The method includes sequentially forming an n− type of layer, a p type of region, and an n+ type of region on a first surface of a substrate, forming a preliminary trench in the n− type of layer by a first etching process and forming a preliminary gate insulating layer by a first thermal oxidation process. The method includes etching the lower surface of the preliminary trench and the preliminary second portion to form a trench by a second etching process and forming a gate insulating layer in the trench by a second thermal oxidation process. The gate insulating layer includes a first and second portion. The preliminary first portion is thicker than the preliminary second portion and the first portion. The first portion thickness is equal to the thickness of the second portion.
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公开(公告)号：US20210067006A1
公开(公告)日：2021-03-04
申请号：US16921157
申请日：2020-07-06
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Jae Hyeon Lee , Han Hee Park , Seong Min Kim , Hyun Woo Noh , Tae Il Yoo , Ji Wan Cha
Abstract: A motor with a cooling system is provided. The motor includes a cooling system cooling a stator with coils wound on a core, in which the cooling system includes a plurality of spray pipes having a plurality of holes and spraying oil through the holes, the plurality of spray pipes is positioned between the stator and a housing of the motor, and the plurality of spray pipes includes pipes disposed at a center over the stator and at both sides spaced apart from each other in a circumferential direction of the stator from the center with predetermined gaps therebetween.
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5.发明申请公开(公告)号：US20190123171A1
公开(公告)日：2019-04-25
申请号：US15823856
申请日：2017-11-28
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Youngkyun Jung , NackYong Joo , Junghee Park , Hyun Woo Noh , JongSeok Lee , Dae Hwan Chun
IPC: H01L29/66 , H01L29/423 , H01L21/3065 , H01L21/308
Abstract: A manufacturing method of a semiconductor device is provided. The method includes sequentially forming an n− type of layer, a p type of region, and an n+ type of region on a first surface of a substrate, forming a preliminary trench in the n− type of layer by a first etching process and forming a preliminary gate insulating layer by a first thermal oxidation process. The method includes etching the lower surface of the preliminary trench and the preliminary second portion to form a trench by a second etching process and forming a gate insulating layer in the trench by a second thermal oxidation process. The gate insulating layer includes a first and second portion. The preliminary first portion is thicker than the preliminary second portion and the first portion. The first portion thickness is equal to the thickness of the second portion.
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Patent Agency Ranking
公开(公告)号：US20170170091A1
公开(公告)日：2017-06-15
申请号：US15181044
申请日：2016-06-13
Applicant: Hyundai Motor Company
Inventor： Young Seok Kim , Hyun Woo Noh , Kyoung Kook Hong , Su Bin Kang
IPC: H01L23/367 , H01L23/495 , H01L23/00
CPC classification number: H01L23/3675 , H01L23/367 , H01L23/492 , H01L23/49537 , H01L23/49541 , H01L24/33 , H01L24/40 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/33181 , H01L2224/371 , H01L2224/8385 , H01L2224/8485 , H01L2924/17747 , H01L2924/00014
Abstract: A power module capable of increasing structural stability and reliability at high temperatures includes: an upper substrate having a metal layer; a lower substrate spaced apart from the upper substrate and having a metal layer facing the metal layer of the upper substrate; a semiconductor element configured to be disposed between the upper substrate and the lower substrate; and at least one leg portion formed on at least one of the metal layer of the upper substrate and the metal layer of the lower substrate to make the upper substrate and the lower substrate be spaced apart from each other at a predetermined interval, in which the leg portion may be electrically connect the semiconductor element to the metal layer of the upper substrate or the metal layer of the lower substrate.
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公开(公告)号：US11133765B2
公开(公告)日：2021-09-28
申请号：US16435883
申请日：2019-06-10
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Ji Wan Cha , Han Hee Park , Jae Hyeon Lee , Seong Min Kim , Hyun Woo Noh , Tae Il Yoo
Abstract: An apparatus for driving a motor for an eco-friendly vehicle is provided. The apparatus includes a motor that has a rotor and a stator and a controller that operates the motor. The motor includes a plurality of stator coils and stator relays and the controller operates the stator relays based on an operation mode to adjust the number of turns of the stator coils.
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公开(公告)号：US09589925B2
公开(公告)日：2017-03-07
申请号：US14800607
申请日：2015-07-15
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Kyoung-Kook Hong , Hyun Woo Noh , Youngkyun Jung , Dae Hwan Chun , Jong Seok Lee , Su Bin Kang
CPC classification number: H01L24/83 , B23K1/19 , B23K20/02 , B23K20/026 , B23K35/025 , B23K35/3006 , B23K2103/08 , B23K2103/18 , B23K2103/52 , B23K2103/56 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/27332 , H01L2224/2741 , H01L2224/27848 , H01L2224/29109 , H01L2224/29139 , H01L2224/29309 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32507 , H01L2224/83097 , H01L2224/832 , H01L2224/83825 , H01L2224/8384 , H01L2224/83906
Abstract: Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.
Abstract translation: 公开了一种用银膏粘合的方法，该方法包括：在半导体器件或基板上涂覆银膏，含有银和铟的银膏; 将半导体布置在基板上; 并且加热银膏以形成接合层，其中半导体器件和衬底通过接合层彼此接合，并且其中铟含量在40％（摩尔）以下。
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公开(公告)号：US11742720B2
公开(公告)日：2023-08-29
申请号：US16921157
申请日：2020-07-06
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Jae Hyeon Lee , Han Hee Park , Seong Min Kim , Hyun Woo Noh , Tae Il Yoo , Ji Wan Cha
Abstract: A motor with a cooling system is provided. The motor includes a cooling system cooling a stator with coils wound on a core, in which the cooling system includes a plurality of spray pipes having a plurality of holes and spraying oil through the holes, the plurality of spray pipes is positioned between the stator and a housing of the motor, and the plurality of spray pipes includes pipes disposed at a center over the stator and at both sides spaced apart from each other in a circumferential direction of the stator from the center with predetermined gaps therebetween.
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公开(公告)号：US20210313924A1
公开(公告)日：2021-10-07
申请号：US17122534
申请日：2020-12-15
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Tae Il Yoo , Jae Hyeon Lee , Seong Min Kim , Hyun Woo Noh , Han Hee Park , Ji Wan Cha
Abstract: A power conversion system includes an inverter having a three-phase circuit including a plurality of power semiconductor devices and configured to supply driving power to a motor according to an applied torque command, and a controller configured to predict a maximum temperature of the inverter based on an actual measured temperature of any one of the plurality of power semiconductor devices and phase current of the motor, and to actively limit the torque command depending on the predicted maximum temperature of the inverter.
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