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1.发明公开
公开(公告)号：EP2982647A1
公开(公告)日：2016-02-10
申请号：EP14770238.5
申请日：2014-03-20
申请人： Nippon Steel & Sumikin Materials Co., Ltd. , FJ Composite Materials Co., Ltd. , Nippon Steel & Sumitomo Metal Corporation
CPC分类号： C01B31/00 , C01B32/00 , C01B32/20 , C01P2006/40 , H01M8/0213 , H01M2008/1095
摘要： A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt% carbon powder composed of 95 to 30 wt% expanded graphite powder and 5 to 70 wt% graphite powder, and (b) 3 to 20 wt% phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 mΩ·cm 2 or less.
摘要翻译： 提供了具有柔软性，优异的抗压强度，甚至导电性的薄板状柔性碳板。 碳板1是通过压缩成型（a）由95〜30重量％的膨胀石墨粉末组成的97〜80重量％的碳粉末和5〜70重量％的膨胀石墨粉末的混合物而获得的厚度为0.05〜2.0mm的碳板， 石墨粉末和（b）不含氨的3〜20重量％的酚醛树脂，其中抗压强度为3MPa以上，弯曲应变为0.6％以上，无裂纹，接触电阻为6μm© ·cm 2以下。
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公开(公告)号：EP2982647B1
公开(公告)日：2018-09-26
申请号：EP14770238.5
申请日：2014-03-20
IPC分类号： C01B32/20 , H01M8/02 , H01M8/10 , C01B32/00 , H01M8/1018 , H01M8/0213
CPC分类号： C01B32/00 , C01B32/20 , C01P2006/40 , H01M8/0213 , H01M2008/1095
摘要： A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt% carbon powder composed of 95 to 30 wt% expanded graphite powder and 5 to 70 wt% graphite powder, and (b) 3 to 20 wt% phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 m©·cm 2 or less.
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公开(公告)号：EP4284125A1
公开(公告)日：2023-11-29
申请号：EP22742870.3
申请日：2022-01-21
发明人： LEE, Jun Ho , CHO, Nam Tae , TSUSHIMA, Eiki
摘要： This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
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公开(公告)号：EP2056344B1
公开(公告)日：2015-01-07
申请号：EP07791499.2
申请日：2007-07-27
IPC分类号： H01L23/373 , H01L23/02
CPC分类号： H01L23/66 , H01L23/3735 , H01L23/3736 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component (5) can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion (1a) can be brought close to that of the electronic component (5) or the like.
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5.发明公开ELECTRONIC COMPONENT STORING PACKAGE AND ELECTRONIC DEVICE 有权LAGERVERPACKUNGFÜRELEKTRONISCHE KOMPONENTEN UND ELEKTRONISCHE ANORDNUNG
公开(公告)号：EP2056344A1
公开(公告)日：2009-05-06
申请号：EP07791499.2
申请日：2007-07-27
IPC分类号： H01L23/373 , H01L23/02
CPC分类号： H01L23/66 , H01L23/3735 , H01L23/3736 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component (5) can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion (1a) can be brought close to that of the electronic component (5) or the like.
摘要翻译： 提供了一种在操作期间产生大量热量的电子部件存储包装和存储这种电子部件的电子设备。 在电子部件储存包装和电子设备中，使用包括至少五层的散热构件（1），其包括具有良好导热性的第一金属层（11）和具有较小热导率的第二金属层（12） 与第一金属层（11）相比，第一金属层（11）和第二金属层（12）交替层叠，第一金属层的最上层和最下层的厚度比至少一个 内部布置的第一金属层（11a）比最下层和最上层的厚。 因此，可以将从电子部件（5）产生的热量良好地散发到外部，并且能够使安装部（1a）的热膨胀系数接近于电子部件（5）等的热膨胀系数。
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