摘要:
When a desired portion (110) is separated from an integrated circuit chip or a semiconductor wafer (100), the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam (160). Prior to separation, the sample is fixed to a micromanipulator probe (120). The sample is moved by the probe to the location for examination and fixed there. The probe is then detached form the sample by the focused ion-beam.
摘要:
A method for attaching a frozen specimen to a manipulator probe tip typically inside a charged-particle beam microscope. The method comprises cooling the probe tip to a temperature at or below that of the frozen specimen, where the temperature of the frozen specimen is preferably at or below the vitrification temperature of water; bringing the probe tip into contact with the frozen specimen, and bonding the probe tip to the frozen specimen by flowing water vapor onto the region of contact between the probe tip and the frozen specimen. The bonded probe tip and specimen may be moved to a support structure such as a TEM grid and bonded to it by similar means. The probe tip can then be disconnected by heating the probe tip or applying a charged-particle beam.