专利检索 ap:("TOKYO OHKA KOGYO CO LTD") AND inv:"TAMURA KOKI" 第 1 页

1.

发明公开
ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD 有权
标题翻译：粘合剂组合物，粘合剂和粘合剂

公开(公告)号：EP2837668A4

公开(公告)日：2015-04-29

申请号：EP13776012

申请日：2013-03-14

申请人： TOKYO OHKA KOGYO CO LTD

发明人： TAMURA KOKI , IMAI HIROFUMI , OGATA TOSHIYUKI , KUBO ATSUSHI , YOSHIOKA TAKAHIRO

IPC分类号： C09J153/00 , C09J5/00 , C09J7/02 , C09J153/02 , H01L21/304 , H01L21/683

CPC分类号： C09J153/00 , C09J5/00 , C09J7/02 , C09J7/20 , C09J7/387 , C09J153/025 , C09J2203/326 , C09J2453/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T428/2883

摘要： The adhesive composition according to the present invention contains a block copolymer, and an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23°C, a storage modulus (G') of 1.5 × 10 5 Pa or less at 220°C, and a loss factor (tan Ã) of 1.3 or less at 220°C.

2.

发明公开
POSITIVE RESIST COMPOSITION, RESIST LAMINATES AND PROCESS FOR THE FORMATION OF RESIST PATTERNS 审中-公开
标题翻译：正光刻胶组合，抗层压板和工艺的形成抗蚀剂结构

公开(公告)号：EP1643307A4

公开(公告)日：2009-12-23

申请号：EP04745842

申请日：2004-06-08

申请人： TOKYO OHKA KOGYO CO LTD

发明人： TAMURA KOKI , KAWANA DAISUKE , YAMADA TOMOTAKA , HOSONO TAKAYUKI , HIRAYAMA TAKU , SATO KAZUFUMI , SHIMBORI HIROSHI , ANDO TOMOYUKI

IPC分类号： G03F7/075 , G03F7/004 , G03F7/039

CPC分类号： G03F7/0757 , G03F7/0045

3.

发明公开
IMMERSION EXPOSURE PROCESS-USE RESIST PROTECTION FILM FORMING MATERIAL, COMPOSITE FILM, AND RESIST PATTERN FORMING METHOD 审中-公开
标题翻译： IMERSIONSBELICHTUNGSPROZESS使用率，抗蚀剂保护膜教学材料，复合膜的抗蚀图案形成方法

公开(公告)号：EP1596251A4

公开(公告)日：2009-05-20

申请号：EP04713169

申请日：2004-02-20

申请人： TOKYO OHKA KOGYO CO LTD

发明人： HIRAYAMA TAKU , TAKASU RYOICHI , SATO MITSURU , WAKIYA KAZUMASA , YOSHIDA MASAAKI , TAMURA KOKI

IPC分类号： G03F7/11 , G03F7/039 , G03F7/20 , H01L21/027

CPC分类号： G03F7/2041 , G03F7/11

摘要： An immersion exposure process-use resist protection film forming material formed on a resist film, the material having characteristics of being transparent to an exposure light, having practically no miscibility with an immersion exposure-use liquid and causing no mixing with the resist film; a protection film formed by this material; a composite film having the resist film; and a resist pattern forming method using them. These can prevent the degeneration of a resist film during immersion exposing and the degeneration of a liquid being used at the same time, and can form a high-resolution resist pattern using immersion exposing.