利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

23 条记录 (耗时 0.011 秒)

    Magnesium-based alloy with superior fluidity and hot-tearing resistance and manufacturing method thereof
    1.
    发明公开
    Magnesium-based alloy with superior fluidity and hot-tearing resistance and manufacturing method thereof 有权
    制造镁基合金的方法，具有改进的流动性和热撕裂强度

    公开(公告)号：EP2381002A2

    公开(公告)日：2011-10-26

    申请号：EP11159585.6

    申请日：2011-03-24

    申请人： Korean Institute of Industrial Technology

    发明人： Kim, Shae K ,  Seo, Jung Ho

    IPC分类号： C22C23/00 ,  C22B26/22 ,  C22C1/02

    CPC分类号： C22C23/00 ,  B22D21/007 ,  C22B9/10 ,  C22B26/22 ,  C22C1/02 ,  C22C1/06 ,  C22F1/06 ,  Y10T428/12417

    摘要： Provided are a magnesium-based alloy and a manufacturing method thereof. In the method, a magnesium alloy is melted into liquid phase, and an alkaline earth metal oxide is added into a molten magnesium alloy. The alkaline earth metal oxide is exhausted through surface reduction reaction between the melt and the alkaline earth metal oxide. Alkaline earth metal produced by the exhaustion reacts with Mg and/or other alloying elements in the magnesium alloy so that an intermetallic compound is formed. The magnesium prepared by the method is excellent in fluidity and hot-tearing resistance. To this end, the alkaline earth metal oxide added is CaO, and the added amount of CaO is 1.4 to 1.7 times the target weight of Ca to be contained in the final Mg alloy.

    摘要翻译： 本发明提供一种镁基合金及其制造方法。 在该方法中，镁合金熔化成液体相，和以碱土金属氧化物加入到熔融的镁合金。 所述碱土金属氧化物是通过熔体和碱土金属氧化物之间的表面还原反应耗尽。 由用尽所产生的碱土金属与Mg和/或在金属间化合物如此做了镁合金等合金元素发生反应形成。 由该方法制得的镁具有优异的流动性和热撕裂的阻力。 为此，加入的碱土金属氧化物为CaO，和CaO的添加量是1.4〜1.7倍的Ca的目标重量被包含在最终Mg合金。

    System and method for manufacturing flexible copper clad laminate film
    5.
    发明公开
    System and method for manufacturing flexible copper clad laminate film 有权
    系统和方法，用于生产挠性覆铜层压薄膜的

    公开(公告)号：EP1750491A3

    公开(公告)日：2008-08-20

    申请号：EP05024159.5

    申请日：2005-11-05

    申请人： Korean Institute of Industrial Technology

    发明人： Lee, Hong Kee ,  Son, Seong-Ho ,  Koo, Seok Bon

    IPC分类号： H05K3/24 ,  H05K1/00 ,  H05K3/28 ,  C25D5/34 ,  C25D7/06

    CPC分类号： H05K3/241 ,  B32B15/00 ,  C25D5/34 ,  C25D7/0614 ,  H05K1/0393 ,  H05K3/282 ,  H05K2203/0392 ,  H05K2203/1545

    摘要： Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.