公开(公告)号：EP3495090B1

公开(公告)日：2024-07-24

申请号：EP17837005.2

申请日：2017-08-02

IPC分类号： B23K35/363 ,  B23K35/36 ,  B23K35/30 ,  H01B1/22 ,  C22C9/02 ,  C22C13/00 ,  C22C13/02 ,  B23K35/26

CPC分类号： B23K35/26 ,  B23K35/30 ,  C22C9/02 ,  C22C13/00 ,  C22C13/02 ,  H01B1/22 ,  B23K35/3615 ,  B23K35/3618

公开(公告)号：EP3193360A1

公开(公告)日：2017-07-19

申请号：EP14901571.1

申请日：2014-09-09

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： KAWASAKI Hiroyoshi ,  ROPPONGI Takahiro ,  SOMA Daisuke ,  SATO Isamu ,  KAWAMATA Yuji

IPC分类号： H01L21/60 ,  B22F1/00 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/50 ,  H01L23/522 ,  H05K3/34

CPC分类号： H01L24/13 ,  B22F1/00 ,  B23K35/0227 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K35/3615 ,  B32B15/01 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  C22C9/00 ,  C22C13/00 ,  C25D5/10 ,  C25D5/12 ,  C25D7/00 ,  H01B1/026 ,  H01L21/2885 ,  H01L21/76885 ,  H01L23/481 ,  H01L23/50 ,  H01L23/522 ,  H01L24/11 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/1369 ,  H01L2924/0002 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0109 ,  H01L2924/01092 ,  H01L2924/35 ,  H05K3/4015 ,  H05K2201/10242

摘要： Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness.
For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3µm, and its Vickers hardness is equal to or higher than 20HV and equal to or less than 60HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

摘要翻译： 本发明提供具有低维氏硬度和小算术平均粗糙度的Cu柱，Cu芯柱，焊点和硅通孔。 对于根据本发明的Cu塔1，其纯度等于或高于99.9％且等于或低于99.995％，其算术平均粗糙度等于或小于0.3μm，并且其维氏硬度等于 或高于20HV且等于或低于60HV。 由于Cu柱1在焊接时不会在熔化温度下熔化，并且可以保持一定的脱离高度（基板之间的空间），所以优选应用于三维安装或间距缩小安装。

公开(公告)号：EP1200226B1

公开(公告)日：2003-07-23

申请号：EP00940570.5

申请日：2000-06-19

申请人： Alpha Fry Limited

发明人： SAMEJA, Ashraf, Ibrahim ,  INGHAM, Anthony, Ellis

IPC分类号： B23K35/363

CPC分类号： B23K35/3607 ,  B23K35/3603 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3617

摘要： A soldering flux composition which comprises: (i) zinc bromide and/or one or more amine hydrohalides and/or one more amine hydrophosphates in an amount of from 30 to 99.5 wt% based on the total weight of components (i) and (ii); and (ii) one or more fluorine-containing compounds selected from fluoroboric acid, ammonium fluoroborate, lithium fluoroborate, sodium fluoroborate and potassium fluoroborate in an amount of from 70 to 0.5 wt% based on the total weight of components (i) and (ii); and (iii) water in an amount not less than that required to solvate components (i) and (ii). The composition of the present invention is particularly useful as a soldering flux for lead-free solder alloys.

公开(公告)号：EP1216784A2

公开(公告)日：2002-06-26

申请号：EP01310603.4

申请日：2001-12-19

申请人： Triumph Group, Inc.

发明人： Stueber, Richard J. ,  Blanche, Brenton L.

IPC分类号： B23K35/00 ,  B23K20/16

CPC分类号： B23K35/004 ,  B23K20/002 ,  B23K20/021 ,  B23K20/16 ,  B23K20/227 ,  B23K20/24 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3617 ,  B23K2201/001 ,  B23K2203/05

摘要： A method of joining superalloy substrates together comprising diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat pressure. The heat and pressure causes the surface of the superalloy, in the presence of the activator, to diffusion bond without the use of a brazing alloy. By eliminating the brazing alloy, a high strength, high temperature bond is achieved, yet there is no molten brazing alloy to be drawn through capillary action into any fine features surrounding the joint being bonded, and there is no residue left at the interface that would diminish the mechanical properties of the joint.

摘要翻译： 一种将超合金基板接合在一起的方法，包括通过在待接合的接头的表面上直接沉积激活剂，然后对接头进行加热来扩散接合超合金基板。 在不使用钎焊合金的情况下，加热和加压导致超级合金的表面在活化剂的存在下扩散接合。 通过消除钎焊合金，实现了高强度，高温接合，但是没有熔融钎焊合金通过毛细作用被拉伸到围绕接合接头的任何细小特征中，并且在界面处没有留下残留物 降低接头的机械性能。

公开(公告)号：EP0776262A1

公开(公告)日：1997-06-04

申请号：EP95931772.0

申请日：1995-09-07

申请人： FRY'S METALS, INC.

发明人： SCHNEIDER, Alvin F. ,  BLUMEL, David B. ,  BROUS, Jack

IPC分类号： B23K35 ,  H05K3

CPC分类号： H05K3/3489 ,  B23K35/3615 ,  B23K35/3618

摘要： A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8 % by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10 % by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

公开(公告)号：EP0753989A1

公开(公告)日：1997-01-15

申请号：EP96201634.1

申请日：1996-06-12

申请人： DELCO ELECTRONICS CORPORATION

发明人： Bristol, Samuel Victor ,  Hanaway, Eugene Horace ,  Mueller, Thomas Richard ,  Barnaby, Mary Jane

IPC分类号： H05K3/28 ,  H05K3/34 ,  C23F11/14 ,  B23K35/36

CPC分类号： B23K35/3618 ,  B23K35/3612 ,  B23K35/3615 ,  C23F11/145 ,  H05K3/282 ,  H05K3/3489 ,  Y10T428/31678

摘要： A coating composition for use in protecting metal, and for use as a soldering flux, and methods involving the same, especially for circuit boards. One coating material can serve as a metal corrosion inhibitor, a no-clean soldering flux, and/or a protective coating in replacement of a conformal coating. In its most preferred form, this invention serves all three functions in the manufacture of an electrical circuit board.
The principal ingredient of the coating is an N - fatty acyl derivative of an amino acid.

摘要翻译： 用于保护金属和用作助焊剂的涂料组合物及其涉及的方法，特别是用于电路板。 一种涂层材料可以用作金属腐蚀抑制剂，不含清洁剂的焊剂，和/或用于替代保形涂层的保护涂层。 在其最优选的形式中，本发明用于制造电路板的所有三个功能。 涂层的主要成分是氨基酸的N-脂肪酰基衍生物。

公开(公告)号：EP0595343A2

公开(公告)日：1994-05-04

申请号：EP93117573.1

申请日：1993-10-29

申请人： SHOWA DENKO KABUSHIKI KAISHA

发明人： Kuramoto, Takeo ,  Watabe, Masataka ,  Noda, Satoshi ,  Shoji, Takashi c/o Showa Denko K.K., Chichibu Res. ,  Sakai, Takekazu

IPC分类号： H05K3/34 ,  B23K35/36 ,  B23K35/02

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/3615 ,  B23K2201/40 ,  B23K2201/42 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/282 ,  H05K2201/10984 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/0557 ,  H05K2203/0591 ,  H05K2203/124 ,  H01L2924/00

摘要： A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

摘要翻译： 在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性 通过含有选自苯并三唑衍生物，萘并三唑衍生物，咪唑衍生物，苯并咪唑衍生物，巯基苯并噻唑衍生物，苯并噻唑硫代脂肪酸衍生物和三嗪衍生物中的至少一种化合物的粘性层形成溶液的金属表面的预定部分，将粉末状 焊接到所得粘性部分，然后通过加热熔化焊料，从而形成焊料膜。

公开(公告)号：EP0452009A3

公开(公告)日：1992-11-19

申请号：EP91302799.1

申请日：1991-03-28

申请人： International Business Machines Corporation

发明人： Frazier, Janice Dianne ,  Jackson, Robert Lloyd ,  Reich, Richard Alan

IPC分类号： B23K35/36 ,  B23K36/363

CPC分类号： B23K35/3612 ,  B23K35/36 ,  B23K35/3615

摘要： A solder paste consists essentially of solder metal powder, and an amount of non-corrosive water soluble flux, said water soluble flux comprising a mixture of 2 non-corrosive watersoluble components, one of which is a non-halogenated amine, preferably triethanolamine and the other of which is an organic moiety with a polar group, preferably GAFAC RE-610.

公开(公告)号：EP2959990A1

公开(公告)日：2015-12-30

申请号：EP14174684.2

申请日：2014-06-27

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Schäfer, Michael ,  Schmitt, Wolfgang

IPC分类号： B22F1/00 ,  B22F7/04 ,  B23K35/34 ,  B23K35/36 ,  B23K35/365 ,  B23K35/02 ,  H01L23/00

CPC分类号： H01L24/83 ,  B22F1/0055 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/04 ,  B22F2301/255 ,  B22F2302/45 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/34 ,  B23K35/36 ,  B23K35/3602 ,  B23K35/3612 ,  B23K35/3615 ,  B23K35/3618 ,  B23K35/365 ,  B23K2201/40 ,  B23K2203/08 ,  H01L24/32 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/00

摘要： Metallzubereitung, die (A) 40 bis 20 bis 50 Gew.-% organisches Lösemittel umfasst.

摘要翻译： 提供一种金属制剂，其含有（A）40至80重量％的至少一种金属颗粒形式，其具有包含至少一种有机化合物的涂层，和（B）> 20至50重量％的有机溶剂 。

公开(公告)号：EP1348513B1

公开(公告)日：2008-07-09

申请号：EP01998186.9

申请日：2001-11-29

申请人： SENJU METAL INDUSTRY CO., LTD. ,  MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： TAGUCHI, Toshihiko ,  TAKAURA, Kunihito ,  TADOKORO, Setsuko ,  HIRATA, Masahiko ,  YOSHIDA, Hisahiko ,  NAGASHIMA, Takashi

IPC分类号： B23K35/36

CPC分类号： B23K35/3613 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3603 ,  B23K35/3615 ,  B23K35/3618

摘要： A solder paste which comprises a mixture of Sn-Zn type lead-free solder particles and an activator-containing rosin flux containing either isocyanuric acid or a halogenoalkyl ester thereof. It is prevented from forming solder balls or voids, and can have satisfactory soldering properties. Also provided is a solder paste which comprises a mixture of lead-free tin-based solder particles comprising Sn-Ag-Cu or Sn-Zn and a flux containing a salicylamide compound. This solder paste also shows no viscosity change and has satisfactory soldering properties.