METHOD OF POLISHING A SURFACE OF A WAVEGUIDE

    公开(公告)号:EP4434674A1

    公开(公告)日:2024-09-25

    申请号:EP23187278.9

    申请日:2020-11-17

    申请人: Lumus Ltd.

    摘要: A method of polishing a target surface of a waveguide to achieve perpendicularity relative to a reference surface is disclosed. The method includes i) providing a polishing apparatus having a polishing plate with a flat surface defining a reference plane, and an adjustable mounting apparatus configured to hold the waveguide during polishing at a plurality of angular orientations; ii) positioning an optical alignment sensor and a light reflecting apparatus such that a first collimated light beam is reflected off of a surface parallel to the reference plane, and a second perpendicular collimated light beam is reflected off of the reference surface; iii) aligning the waveguide within the polishing apparatus such that the reflections received by the optical alignment sensor align within the optical alignment sensor, thereby being indicative of perpendicularity between the reference plane and the reference surface; and iv) polishing the target surface of the aligned waveguide.

    AN ALIGNMENT MEMBER AND A METHOD FOR ALIGNING A SENSOR BOARD

    公开(公告)号:EP3340599A1

    公开(公告)日:2018-06-27

    申请号:EP16205246.8

    申请日:2016-12-20

    申请人: Axis AB

    IPC分类号: H04N5/225

    摘要: An alignment member (10, 50) for alignment of a sensor board (12, 52) relative an optics unit (11, 51) is disclosed. The alignment member (10, 50) is arranged to couple the sensor board (12, 52) to the optics unit (11, 51). The alignment member (10, 50) comprises: a section (15) formed by a thermoplastic material and arranged to support the sensor board (12, 52); and a heating element (30a, 30b, 30c, 40, 41) which upon activation is arranged to transfer heat to the section such that the section (15) at least partly is heated to a temperature being at least the glass transition temperature for the thermoplastic material for enabling alignment of the sensor board (12, 52) relative the optics unit (11, 51). A camera arrangement (1, 5) comprising an alignment member (10, 50) and a method for aligning a sensor board relative an optics unit are also disclosed.

    DEVICE AND METHOD FOR MEASURING AND ALIGNING A FIRST COMPONENT AND A SECOND COMPONENT IN RELATION TO EACH OTHER
    6.
    发明公开
    DEVICE AND METHOD FOR MEASURING AND ALIGNING A FIRST COMPONENT AND A SECOND COMPONENT IN RELATION TO EACH OTHER 有权
    装置和方法用于测量和的第一组件的分配和第二组件相对于彼此

    公开(公告)号:EP2344840A4

    公开(公告)日:2017-01-25

    申请号:EP09819493

    申请日:2009-10-08

    申请人: ACOEM AB

    发明人: STRÖMBERG PETER

    IPC分类号: G01B11/27

    CPC分类号: G01B11/27

    摘要: The invention relates to a device (1) for measuring and alignment of a first component (2, 4) and a second component (3, 5) in relation to each other, where the device comprises a first detector unit (6) disposed to be mounted on the first component (2, 4) and a second detector unit (7) disposed to be mounted on the second component (3, 5) as well as a control unit (12) which is connected to the first detector unit (6) and the second detector unit (7). The device (1) comprises a first geometric pattern (16) disposed on the first detector unit (6) and a second geometric pattern disposed on the second detector unit (7). The position of the first geometric pattern (16) can be detected by the second detector unit (7) and the position of the second geometric pattern can be detected by the first detector unit (6). The invention also relates to a method for aligning a first component (2, 4) and a second component (3, 5).

    ROBOT ALIGNMENT SYSTEMS AND METHODS OF ALIGNING A ROBOT
    7.
    发明公开
    ROBOT ALIGNMENT SYSTEMS AND METHODS OF ALIGNING A ROBOT 有权
    机器人定位系统和注册机器人的方法

    公开(公告)号:EP2957396A3

    公开(公告)日:2016-09-14

    申请号:EP15167848.9

    申请日:2015-05-15

    IPC分类号: B25J9/16

    摘要: Presently disclosed robotic alignment systems (200) and methods (300) may allow for alignment of a platform (208) of a robot (202) with respect to an access port (218) of a part (204), such as a wing (102) of an aircraft (100). A robot (202) positioned under the wing (102) may include a base (206) and an upper platform (208) coupled together by a plurality of legs (210). The upper platform (208) may be moveable with respect to the base (206) in six degrees of freedom in order to be aligned with the access port (218) of the wing (102) so that the robot (202) may insert a tool through the access port (218) without damaging the wing (102). Disclosed robotic alignment systems (200) may include a calibration plate (226) that is inserted into the access port (218). A number of positioning devices (216) on the upper platform (208) of the robot (202) may interact with the calibration plate (226) in order to align the upper platform (208) with respect to the calibration plate (226), and thereby with respect to the access port (218).

    MULTIFUNCTION WAFER AND FILM FRAME HANDLING SYSTEM
    9.
    发明公开
    MULTIFUNCTION WAFER AND FILM FRAME HANDLING SYSTEM 审中-公开
    多功能系统用于处理晶片和膜架

    公开(公告)号:EP2891173A4

    公开(公告)日:2016-03-30

    申请号:EP13832999

    申请日:2013-09-02

    IPC分类号: H01L21/683 H01L21/687

    摘要: A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.