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    Method of and apparatus for dynamic alignment of substrates
    1.
    发明公开
    Method of and apparatus for dynamic alignment of substrates 有权
    用于基材的动态调整的方法和装置

    公开(公告)号：EP1102311A3

    公开(公告)日：2004-09-15

    申请号：EP00310351.2

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W. ,  Freund, Charles W.

    IPC分类号： H01L21/00

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： A wafer is transported on a blade of a robot and along a path through a port and into a module of semiconductor manufacturing equipment. The port has a transverse axis that intersects the path. Dynamic alignment determines the position of the center of the wafer with respect to the center of the blade as the wafer is transported, and uses two through-beam sensors positioned along the transverse axis according to latency characteristics of the sensors. The positioning of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes. One of the sensors is positioned for operations with respect to both sizes of wafers, whereas the second of the sensors operates and is positioned along the transverse axis for only one size wafer, and a third of the sensors operates and is positioned along the transverse axis for only the other size wafer. Three sensors may be provided for the port at each facet of each module of the semiconductor equipment. Logic circuitry processes the transition signals from appropriate ones of the sensors to identify the particular one of the ports through which the wafer is being transported. The detected position information (e.g., having possible misalignment) is then used by the robot when the wafer is subsequently positioned into a given chamber. The subsequent positioning therefore compensates for any misalignment and ensures accurately placed wafers.

    Industrieroboter und Verfahren zum Steuern eines Industrieroboters
    3.
    发明公开
    Industrieroboter und Verfahren zum Steuern eines Industrieroboters 审中-公开
    工业机器人和用于控制工业机器人的方法

    公开(公告)号：EP2075098A3

    公开(公告)日：2017-12-13

    申请号：EP08171247.3

    申请日：2008-12-10

    申请人： KUKA Roboter GmbH

    发明人： Rolke, Rajko ,  Demir Halim

    IPC分类号： B25J9/16 ,  B23K26/08 ,  B23K26/04

    CPC分类号： B25J9/1684 ,  G05B2219/36404 ,  G05B2219/36405 ,  G05B2219/36414 ,  G05B2219/45104 ,  G05B2219/4705 ,  G05B2219/4706 ,  G05B2219/4708 ,  G05B2219/4709 ,  G05B2219/49386

    摘要： Die Erfindung betrifft einen Industrieroboter (R) und ein Verfahren zum Steuern eines Industrieroboters (R). Im Rahmen des Verfahrens wird ein Werkzeug (6) mittels des Industrieroboters (R) entlang einer Bahn bewegt. Das Werkzeug (6) bearbeitet während des Bewegens ein Werkstück (21a-21d). Während des Bewegens des Werkzeugs (6) entlang der Bahn wird eine optische Markierung (25, 27) am Werkstück (21a-21d) erkannt und aufgrund der erkannten optischen Markierung (25, 27) wird das Werkzeug (6) insbesondere mittels des Industrieroboters (R) angesteuert.

    摘要翻译： 本发明涉及工业机器人（R）和用于控制工业机器人（R）的方法。 作为该过程的一部分，工具（6）通过工业机器人（R）沿着路径移动。 工具（6）在移动过程中处理工件（21a-21d）。 期间沿着的路径的工具（6）的移动的光学标记（25，27）在工件上被检测到（21A-21D）和检测到的光学标记（25，27）时，在特定的工具（6）的由工业机器人的装置的基础上（ R）驱动。

    Method of and apparatus for determining substrate offset using optimization techniques
    4.
    发明公开
    Method of and apparatus for determining substrate offset using optimization techniques 有权
    Verfahren undGerätzur Entscheidung einer Substratsverspetchiebung mit Optimierungsmethoden

    公开(公告)号：EP1102137A2

    公开(公告)日：2001-05-23

    申请号：EP00310347.0

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W.

    IPC分类号： G05B19/408 ,  H01L21/00

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： Dynamic alignment of a wafer with a support blade that carries the wafer is provided by making a determination of an approximate value of an offset of the wafer with respect to a desired location of the wafer in a module. This determination is in terms of a statement of an optimization program, which effectively keeps an offset computation time period within a wafer transfer time period. By a method, and by programming a computer, the wafer is picked up from a first location using an end effector and the end effector is moved to transfer the picked up wafer from the first location past a set of sensors to produce sensor data. In the event of an unknown offset of a wafer, the picking up operation results in the picked up wafer being misaligned with respect to a desired position of the picked up wafer on the end effector. When the desired location corresponds to original target coordinates to which the end effector normally moves, the original target coordinates are modified to compensate for the approximate value of the offset. The end effector is then caused to place the picked up wafer at the modified target coordinates to compensate for the unknown offset and the misalignment. By determining the amount of such wafer offset using the optimization program, the probability of convergence to a precise value of the offset is higher than with non-optimization programs.

    摘要翻译： 通过确定晶片相对于晶片在模块中的期望位置的偏移的近似值来提供晶片与承载晶片的支撑刀片的动态对准。 该确定是根据优化程序的说明，其有效地保持晶片传送时间段内的偏移计算时间段。 通过一种方法，并且通过对计算机进行编程，使用末端执行器从第一位置拾取晶片，并且移动末端执行器以将所拾取的晶片从第一位置传送通过一组传感器以产生传感器数据。 在晶片的未知偏移的情况下，拾取操作导致拾取晶片相对于末端执行器上的拾取晶片的期望位置不对准。 当所需位置对应于末端执行器正常移动到的原始目标坐标时，原始目标坐标被修改以补偿偏移的近似值。 然后使端部执行器将拾取的晶片放置在修改的目标坐标处以补偿未知偏移和未对准。 通过使用优化程序确定这种晶片偏移的量，收敛到偏移的精确值的概率高于非优化程序。

    System and method for automated positioning of a substrate in a processing chamber
    6.
    发明公开
    System and method for automated positioning of a substrate in a processing chamber 失效
    系统和Verfahrenfürautomatische定位在einem Prozessraum的底层。

    公开(公告)号：EP0597637A1

    公开(公告)日：1994-05-18

    申请号：EP93308849.4

    申请日：1993-11-05

    申请人： APPLIED MATERIALS, INC.

    发明人： Shmookler, Simon ,  Weinberg, Andrew G. ,  McGrath, Martin J.

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67259 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37608 ,  G05B2219/45031 ,  G05B2219/49299 ,  G05B2219/50151 ,  H01L21/681

    摘要： The disclosure relates to a processing apparatus having a central transfer chamber (2); a plurality of peripheral chambers (3a, 3b) positioned around the periphery of said central transfer chamber; and a micro-processor controlled wafer transfer robot (4) disposed in said transfer chamber and having a wafer support (4a) for loading, moving and unloading wafer to and from said peripheral chambers. The wafer support is moved within said central transfer chamber generally along an arcuate path between the peripheral chambers. Reference signals are generated indicative of the position of a wafer support reference point (4c) by a sensor array (6, 8) having at least two sensors mounted along an axis generally transverse to the arcuate path which are triggered by the leading and trailing edges of the moving wafer as it passes to develop corresponding wafer position signals from which a wafer position reference point can be determined. The micro-processor (12) receiving wafer support reference signals and wafer position signals, calculates the location of the wafer relative to the wafer support, and controls movement of the the wafer support to a corresponding offset position relative to a preselected location (65a, 65b) in a peripheral chamber so as to position the wafer accurately at the preselected location in one of the peripheral chambers (3a, 3b).

    摘要翻译： 本公开涉及一种具有中央传送室（2）的处理设备; 位于所述中央传送室的周围的多个周边室（3a，3b）; 以及设置在所述传送室中的微处理器控制的晶片传送机器人（4），并且具有用于将晶片装载到所述外围室中并从所述外围室移出和移出晶片支撑件（4a）。 晶片支撑件通常沿着周边室之间的弧形路径在所述中央传送室内移动。 通过传感器阵列（6,8）产生指示晶片支撑参考点（4c）的位置的参考信号，传感器阵列（6,8）具有沿着大致横向于弧形路径的轴线安装的至少两个传感器，传感器阵列由前缘和后缘 移动的晶片通过以形成相应的晶片位置信号，从晶片位置信号可以确定晶片位置参考点。 接收晶片支撑参考信号和晶片位置信号的微处理器（12）计算晶片相对于晶片支撑件的位置，并且控制晶片支撑件相对于预选位置（65a， 65b），以便将晶​​片准确地定位在一个外围室（3a，3b）中的预选位置。

    Method of and apparatus for dynamic alignment of substrates
    8.
    发明公开
    Method of and apparatus for dynamic alignment of substrates 有权
    Vorrichtung zur dynamischen Ausrichtung von Substraten

    公开(公告)号：EP1102311A2

    公开(公告)日：2001-05-23

    申请号：EP00310351.2

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W. ,  Freund, Charles W.

    IPC分类号： H01L21/00

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： A wafer is transported on a blade of a robot and along a path through a port and into a module of semiconductor manufacturing equipment. The port has a transverse axis that intersects the path. Dynamic alignment determines the position of the center of the wafer with respect to the center of the blade as the wafer is transported, and uses two through-beam sensors positioned along the transverse axis according to latency characteristics of the sensors. The positioning of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes. One of the sensors is positioned for operations with respect to both sizes of wafers, whereas the second of the sensors operates and is positioned along the transverse axis for only one size wafer, and a third of the sensors operates and is positioned along the transverse axis for only the other size wafer. Three sensors may be provided for the port at each facet of each module of the semiconductor equipment. Logic circuitry processes the transition signals from appropriate ones of the sensors to identify the particular one of the ports through which the wafer is being transported. The detected position information (e.g., having possible misalignment) is then used by the robot when the wafer is subsequently positioned into a given chamber. The subsequent positioning therefore compensates for any misalignment and ensures accurately placed wafers.

    摘要翻译： 晶片在机器人的刀片上并且沿着通过端口的路径被输送到半导体制造设备的模块中。 该端口具有与该路径相交的横轴。 当晶片被输送时，动态对准确定晶片的中心相对于叶片的中心的位置，并且根据传感器的延迟特性使用沿横轴定位的两个通过光束的传感器。 传感器的定位确保移动的晶片将破坏或制造第一传感器的光束，并且第一传感器将在移动的晶片断裂或制造第二传感器的光束之前产生第一转换信号，并且 在第二传感器产生第二转换信号之前。 可以相对于具有不同尺寸的晶片执行动态对准。 传感器中的一个被定位用于相对于两种尺寸的晶片的操作，而第二传感器操作并且沿着横向轴线定位仅用于一个尺寸的晶片，并且三分之一的传感器操作并且沿横轴 仅用于其他尺寸的晶片。 可以为半导体设备的每个模块的每个面处的端口提供三个传感器。 逻辑电路处理来自适当传感器的转换信号，以识别晶片通过其传输的特定端口。 当晶片随后定位到给定的室中时，机器人使用检测到的位置信息（例如，具有可能的未对准）。 因此，随后的定位补偿任何未对准并确保准确放置的晶片。

    ON THE FLY CENTER-FINDING DURING SUBSTRATE HANDLING IN A PROCESSING SYSTEM
    9.
    发明公开
    ON THE FLY CENTER-FINDING DURING SUBSTRATE HANDLING IN A PROCESSING SYSTEM 有权
    INSTANT ZENTRIERBESTIMMUNG基材管理，制造系统期间

    公开(公告)号：EP1062687A1

    公开(公告)日：2000-12-27

    申请号：EP99909689.4

    申请日：1999-03-01

    申请人： Applied Materials, Inc.

    发明人： SUNDAR, Satish ,  EBBING, Peter, F.

    IPC分类号： H01L21/00

    CPC分类号： H01L21/681 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37608 ,  G05B2219/45031 ,  G05B2219/49299 ,  G05B2219/50151

    摘要： A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point. A suitable number of trigger points on the edge of a circular substrate will define a circle, so the center of the circle can be calculated, and the location of the substrate can be adjusted to account for any offset from the reference point.