公开(公告)号：EP4435050A1

公开(公告)日：2024-09-25

申请号：EP22895312.1

申请日：2022-10-18

申请人： ThreeBond Co., Ltd.

发明人： SOGA, Tetsunori

IPC分类号： C08L63/00 ,  C08G59/66 ,  C08K5/17 ,  C08K5/37 ,  C09J11/00 ,  C09J11/06 ,  C09J133/04 ,  C09J163/00 ,  C09J201/00 ,  F16B39/02

CPC分类号： C08G59/66 ,  C08K5/17 ,  C08K5/37 ,  C08L63/00 ,  C09J11/00 ,  C09J11/06 ,  C09J133/04 ,  C09J163/00 ,  C09J201/00 ,  F16B39/02

摘要： The present invention provides a microcapsule-type curable resin composition to be applied to a screwing member, capable of reducing the generation of crumbs when the screwing member is screwed into a base material, having excellent anti-loosening effect. Further, the present invention provides a method for producing a screwing member, including applying the microcapsule-type curable resin composition to a surface of a screwing member, and drying the composition to form a precoated adhesive layer. Further, the present invention provides a screwing member having a precoated adhesive layer formed by applying the microcapsule-type curable resin composition to the surface of the screwing member and drying the composition.
The present invention relates to a microcapsule-type curable resin composition containing the following components (A) to (D) :
Component (A): an epoxy resin
Component (B): a water-dispersible binder
Component (C): a curing agent for an epoxy resin
Component (D): a hollow filler.

公开(公告)号：EP4424769A1

公开(公告)日：2024-09-04

申请号：EP22887006.9

申请日：2022-10-25

申请人： Sakata INX Corporation

发明人： SHIRAKAWA, Yuki ,  FUKUSHIMA, Ko

IPC分类号： C08L63/00 ,  C08K3/08 ,  C08K5/09 ,  C08K5/13 ,  C08K5/1539 ,  C08K5/37 ,  C08L61/06 ,  H01B1/22

CPC分类号： C08K3/08 ,  C08K5/13 ,  C08K5/09 ,  C08K5/1539 ,  C08K5/37 ,  C08L61/06 ,  C08L63/00 ,  H01B1/22

摘要： An object is to provide a conductive resin composition that demonstrates good conductivity and excellent adhesion (joining strength) with respect to various types of base materials and is useful as conductive inks, conductive adhesives, circuit connection materials, etc., and also to provide a conductive film formed by the conductive resin composition, a conductive ink containing the conductive resin composition, a conductive adhesive containing the conductive resin composition, and a circuit connection material containing the conductive resin composition. As a solution, a conductive resin composition is provided that contains (a) tin powder, (b) epoxy resin, and (c) organic acid compound, and satisfies requirement (A) and/or requirement (B) below:
(A): the content of the (a) tin powder, relative to the total amount, 100% by mass, of the (a) tin powder, (b) epoxy resin, and (c) organic acid compound, is 90.1% by mass or higher; and/or
(B): (d) curing agent is contained, and (d) curing agent includes one or more types selected from (d1) acid anhydride-based curing agents, (d2) thiol-based curing agents and (d3) phenol-based curing agents.

公开(公告)号：EP3636800B1

公开(公告)日：2024-03-20

申请号：EP19213692.7

申请日：2017-09-22

发明人： KINLEN, Patrick J. ,  KRIENKE, Kenneth A.

IPC分类号： C23C18/12 ,  C23F11/00 ,  C09D5/08 ,  C09D7/63 ,  C23F11/18 ,  C23F11/16 ,  C09D175/04 ,  C08K5/37

公开(公告)号：EP4317234A1

公开(公告)日：2024-02-07

申请号：EP22780475.4

申请日：2022-03-24

申请人： Namics Corporation

发明人： ABE Nobuyuki ,  MARUYAMA Kazuyuki

IPC分类号： C08G59/18 ,  C09J4/02 ,  C09J11/06 ,  G03B11/04 ,  G03B17/02 ,  C08K5/37 ,  C08L101/06 ,  C09J163/00 ,  C08L63/00 ,  C08G75/045 ,  C08K3/013 ,  G02B7/02

摘要： The present invention provides a curable resin composition which gives a cured product with lowered surface gloss, and a sealing material comprising the same. The present invention also provides a cured product obtained by curing the curable resin composition or sealing material. The present invention further provides a camera module comprising the cured product.

公开(公告)号：EP4299670A1

公开(公告)日：2024-01-03

申请号：EP22759973.5

申请日：2022-02-17

申请人： Hanwha Solutions Corporation

发明人： LEE, In Jun ,  LIM, Jae Yun ,  KIM, Kisik ,  PARK, Jeong Hyun ,  PARK, Sang Kyu

IPC分类号： C08L33/06 ,  C08K3/04 ,  C08K5/13 ,  C08K5/098 ,  C08K5/37 ,  C08J3/24

摘要： The present invention relates to a semiconductive resin composition for a high voltage power cable. Specifically, the present invention relates to a semiconductive resin composition comprising a base resin in which ethylene butyl acrylates having different melting indices are mixed, carbon black, an antioxidant, and a crosslinking agent. In addition, the present invention relates to a semiconductive resin composition for a high voltage power cable, the composition having excellent scorch stability and processability and low volume resistance even at a high temperature.

公开(公告)号：EP4185618A1

公开(公告)日：2023-05-31

申请号：EP21846997.1

申请日：2021-07-20

申请人： Applied Materials, Inc.

发明人： LUO, Yingdong ,  GANAPATHIAPPAN, Sivapackia ,  ZHANG, Daihua ,  NG, Hou T. ,  PATIBANDLA, Nag B.

IPC分类号： C08F20/14 ,  C08F2/50 ,  C08F2/44 ,  C08K5/37 ,  C08K3/013 ,  C09K11/08 ,  H01L33/50

公开(公告)号：EP4144791A1

公开(公告)日：2023-03-08

申请号：EP21796726.4

申请日：2021-04-15

申请人： BRIDGESTONE CORPORATION

发明人： KOSAI, Tomoyuki

IPC分类号： C08K5/37 ,  C08K5/372 ,  C08L21/00

摘要： Provided is a rubber composition that can improve the balance between the hysteresis loss of rubber at low strain and the hysteresis loss of rubber at high strain. The rubber composition comprises a rubber component, and at least one compound selected from the group consisting of the general formulas (1) and (2),

        HS-R-COOM     (1),

and

        MOCO-R-(S) n -R-COOM     (2),

where R is independently a linear or branched hydrocarbylene group having 8 or more carbon atoms in a linear portion connecting the sulfur atom and the COOM group; M is independently an atom selected from the group consisting of an alkali metal and an alkaline earth metal; and n is an integer from 2 to 8.

公开(公告)号：EP4141070A1

公开(公告)日：2023-03-01

申请号：EP21894916.2

申请日：2021-10-22

申请人： Kolon Industries, Inc.

发明人： KIM, Myung Jong ,  SON, Jeong Soon

IPC分类号： C08L25/06 ,  C08L57/02 ,  C08K5/37 ,  C09D125/06

摘要： The present invention relates to a resin composition including a modified petroleum resin having a structure in which a molecular weight regulator is bonded to at least one terminus of both terminuses of an at least partially hydrogenated or non-hydrogenated petroleum resin, wherein the modified petroleum resin comprises at least one styrene monomer-derived unit structure, wherein a Gardner color of the resin composition is 10 or less.

公开(公告)号：EP4105274A1

公开(公告)日：2022-12-21

申请号：EP21754640.7

申请日：2021-01-19

申请人： NOK Corporation

发明人： HIROSE, Shiro

IPC分类号： C08K5/37 ,  C08K5/40 ,  C08L11/00

摘要： A chloroprene rubber composition comprising 0.8 to 4 parts by weight of 2,4,6-trimercapto-s-triazine and 0.5 to 4.5 parts by weight of tetrabenzylthiuram disulfide based on 100 parts by weight of chloroprene rubber. The chloroprene rubber composition maintains processability (scorch time) and productivity (crosslinking rate) equivalent to those of conventionally used crosslinking systems, without using substances subject to environmental regulations in crosslinking systems, and at the same time, improves physical properties, such as strength, elongation, and compression set characteristics.

公开(公告)号：EP4089144A1

公开(公告)日：2022-11-16

申请号：EP21738268.8

申请日：2021-01-05

申请人： Showa Denko K.K.

发明人： SAGAE Ichiro

IPC分类号： C08K5/37 ,  C08L11/00 ,  C08K3/22

摘要： The present invention relates to a composition including a chloroprene polymer, a molded body, and a method for producing a molded body, and the composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 mercapto groups in a molecule. An amount of the thiol compound (B) is 1.5 to 20 parts by mass per 100 parts by mass of the chloroprene polymer (A).