BONDING DEVICE
    93.
    发明公开
    BONDING DEVICE 审中-公开
    接合装置

    公开(公告)号:EP3124209A1

    公开(公告)日:2017-02-01

    申请号:EP16181067.6

    申请日:2016-07-25

    IPC分类号: B29C65/52 A41H43/04 D06H5/00

    摘要: The bonding device (1) includes a base portion (2), the nozzle (10) discharging adhesive, an upper roller (12) and a lower roller (18) that clamp and feed an upper sheet (C2) and a lower sheet (C1), a lower feed arm (7) rotatably supporting the lower roller (18), a lower roller base (35) holding the lower feed arm (7), and an adjustment mechanism (700) that adjusts an attachment position of the lower roller base (35). The adjustment mechanism (700) includes a first shaft portion (71) extending from a fixing face of the base portion in a perpendicular direction, and a rotating member (73) having a first hole portion (738), into which the first shaft portion (71) is inserted, extending in parallel to the perpendicular direction, and being capable of rotating around a rotation axis that is eccentric with respect to the first shaft portion (71). The distance between the upper sheet (C2) and the nozzle (10) does not change as a result of the lower roller base (35) moving in the up-down direction.

    摘要翻译: 粘合装置1包括基部2,喷出粘合剂的喷嘴10,夹持并供给上片材C2和下片材2的上辊12和下辊18, C1),可旋转地支撑下辊(18)的下进给臂(7),保持下进给臂(7)的下辊座(35),以及调整机构(700) 滚筒基座(35)。 调整机构700包括从基部的垂直方向的固定面延伸的第一轴部71和具有第一孔部738的旋转部件73, (71)以与所述铅垂方向平行的方式延伸并能够绕相对于所述第一轴部(71)偏心的旋转轴旋转。 上部片材(C2)和喷嘴(10)之间的距离不会由于下部辊座(35)沿上下方向移动而变化。