公开(公告)号：EP2910666A1

公开(公告)日：2015-08-26

申请号：EP14156103.5

申请日：2014-02-21

申请人： Atotech Deutschland GmbH

发明人： Janssen, Boris Alexander ,  Lautan, Donny

IPC分类号： C23C18/18 ,  C23C18/32 ,  C23C18/50 ,  C23C18/16 ,  C23F1/30

CPC分类号： C23C18/32 ,  C23C18/1608 ,  C23C18/1841 ,  C23C18/42 ,  C23C18/50 ,  C23F1/02 ,  C23F1/30 ,  C23F1/44 ,  H05K3/187 ,  H05K3/244 ,  H05K3/26

摘要： The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.

摘要翻译： 本发明公开了一种将金属或金属合金化学镀在电子器件例如印刷电路板的铜特征上的方法，该印刷电路板抑制不期望的跳过电镀和外部电镀。 该方法包括以下步骤：i）提供这种基材，ii）用贵金属离子活化铜特征; iii）用含有酸，卤离子源和选自硫脲，硫脲衍生物和包含硫脲基团的聚合物的添加剂的含水预处理组合物除去过量的贵金属离子或其形成的沉淀物，以及iv）无电解 电镀金属或金属合金层。

公开(公告)号：EP2855732A2

公开(公告)日：2015-04-08

申请号：EP13728988.0

申请日：2013-05-31

申请人： Atotech Deutschland GmbH

发明人： BRUNNER, Heiko ,  PICALEK, Jan ,  BEJAN, Iulia ,  KRAUSE, Carsten ,  BERA, Holger ,  RÜCKBROD, Sven

IPC分类号： C23C18/34 ,  C23C18/50 ,  H01L21/288

CPC分类号： C23C18/34 ,  C23C18/1633 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76849

摘要： The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.

公开(公告)号：EP1978129A3

公开(公告)日：2014-12-17

申请号：EP08005860.5

申请日：2008-03-27

申请人： EBARA CORPORATION

发明人： Yakuwa, Hiroshi

IPC分类号： C23C18/50 ,  C25D3/12 ,  C25D5/48 ,  C23C18/16 ,  C25D7/00 ,  C23C18/12 ,  C23C18/32 ,  C23C28/02

CPC分类号： C23C18/1254 ,  C23C10/02 ,  C23C10/48 ,  C23C10/52 ,  C23C18/1216 ,  C23C18/1696 ,  C23C18/32 ,  C23C18/50 ,  C23C28/021 ,  C25D3/12 ,  C25D5/48 ,  C25D5/50 ,  Y02T50/67 ,  Y10T428/31678

摘要： There is provided a method for forming a corrosion-resistant protective film, which can preventing peel off of the protective film and enables long-term stable use of the film under high-temperature conditions. The corrosion-resistant film forming method includes the steps of: carrying out Ni (or Ni-B) plating of a surface of a substrate of a Ni-Cr alloy to form a Ni (or Ni-B) layer on the substrate surface; and carrying out Al diffusion treatment of the surface of the Ni (or Ni-B) layer to form a protective layer of Ni-Al.

公开(公告)号：EP2588644B1

公开(公告)日：2014-06-18

申请号：EP11738647.4

申请日：2011-06-30

申请人： Schauenburg Ruhrkunststoff GmbH

发明人： KOPPE, Stefan

IPC分类号： C23C18/16 ,  C23C18/48 ,  C23C18/50 ,  C25D3/56 ,  C25D3/64 ,  C25D5/00

CPC分类号： C23C18/1653 ,  C23C18/1671 ,  C23C18/1689 ,  C23C18/50 ,  C25D3/64

公开(公告)号：EP2588644A1

公开(公告)日：2013-05-08

申请号：EP11738647.4

申请日：2011-06-30

申请人： Schauenburg Ruhrkunststoff GmbH

发明人： KOPPE, Stefan

IPC分类号： C23C18/16 ,  C23C18/48 ,  C23C18/50 ,  C25D3/56 ,  C25D3/64 ,  C25D5/00

CPC分类号： C23C18/1653 ,  C23C18/1671 ,  C23C18/1689 ,  C23C18/50 ,  C25D3/64

摘要： The invention relates to a method for producing a mixed noble metal/metal layer that has particularly advantageous tribological properties, having the following steps: preparing a bath for the electroless deposition of a metal layer, said bath additionally containing at least one type of noble metal ions; introducing a substrate into the bath; and applying an electric voltage.

公开(公告)号：EP2225408A2

公开(公告)日：2010-09-08

申请号：EP08853518.2

申请日：2008-11-28

申请人： ElringKlinger AG

发明人： ZERFASS, Hans-Rainer ,  KIEFER, Thomas ,  TIETZ, Frank

IPC分类号： C23C18/50

CPC分类号： C23C18/44 ,  C23C18/28 ,  C23C18/40 ,  C23C18/50

摘要： A metal substrate containing chromium is proposed, wherein adequate chromium retention is ensured under the operating conditions of SOFC fuel cells. These substrates have a coating, which is deposited without current and is substantially free of chromium, comprising one or more metal elements, selected from the group of transition metals (except chromium) and the noble metals. In addition, a method is proposed for producing a metal substrate containing chromium, which is provided with a coating, which is deposited without current and is substantially free of chromium.

公开(公告)号：EP2055419A1

公开(公告)日：2009-05-06

申请号：EP08251752.5

申请日：2008-05-20

申请人： Magtech Technology Co., Ltd

发明人： Ho, Climent

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K35/26 ,  B23K35/36 ,  C23C18/32 ,  C23C18/50 ,  C23C18/54

CPC分类号： B23K1/0008 ,  B23K1/19 ,  B23K1/203 ,  B23K35/26 ,  B23K35/262 ,  B23K2201/34 ,  B23K2203/15 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/1824 ,  C23C18/36

摘要： The present application relates to a method of soldering a magnesium alloy workpiece. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.

摘要翻译： 本申请涉及到焊接的镁合金工件的方法。 该方法包括提供一镁合金工件; 修改所述镁合金工件的表面上; 执行高磷（7〜12重量％的P）的镁合金工件的表面上化学镀镍的过程; 制备用于不同无铅的锡合金焊料的焊料助熔剂; 并进行锡焊接工艺焊接镁合金工件与所述无铅的锡合金焊料含其相应的焊剂。

公开(公告)号：EP1907602A1

公开(公告)日：2008-04-09

申请号：EP05782893.1

申请日：2005-07-13

申请人： L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude ,  INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： NASU, Akinobu, L'Air Liquide, SA ,  CHEN, Shyuan-Fang, ITRI ,  CHEN, I-Chung, ITRI ,  LIN, Tsu-An, ITRI ,  HSIUNG, Chiung, Sheng, ITRI

IPC分类号： C23C18/50 ,  C23C18/18 ,  C23C18/54

CPC分类号： C23C18/50 ,  C23C18/1844 ,  C23C18/1893 ,  Y10T428/1095

摘要： Electroless NiWP layers are used for TFT Cu gate process. The NiWP deposition process comprises the following steps. (a) Cleaning of the base surface using for example UV light, ozone solution and/or alkaline mixture solution, (b) micro-etching of the base surface using, e.g. diluted acid, (c) catalyzation of the base surface using, e.g. SnCl2 and PdCl2 solutions. (d) conditioning of the base surface using reducing agent solution, and (e) NiWP deposition. It has been discovered that NiWP layers deposited under certain conditions could provide good adhesion to the glass substrate and to the Cu layer with a good Cu barrier capability. A NiWP layer in useful for adhesion, capping and/or barrier layers for TFT Cu gate process (e.g. for flat screen display panels).

公开(公告)号：EP1799881A2

公开(公告)日：2007-06-27

申请号：EP05784829.3

申请日：2005-09-26

申请人： AHC-Oberflächentechnik GmbH

发明人： BIALKOWSKI, Doris ,  HOLLÄNDER, Alfons

IPC分类号： C23C18/36 ,  C23C18/50 ,  C23C18/16

CPC分类号： C23C18/50 ,  C23C18/1662 ,  C23C18/36

摘要： The invention relates to a lead-free nickel phosphorous dispersion alloy on a metallic substrate surface, which may be obtained by non-galvanic deposition in an electrolyte, comprising 4 to 7 g/l nickel ions, 15 to 40 g/l hypophospite, at least one stabiliser, 5 to 400 mg/l of an alkylaryloxydialkylbenzylammonium chloride or a partially-fluorinated betain, 50 to 60 g/l of a complexing agent A, containing a carboxylic acid, 5 to 40 g/l of a complexing agent B containing a carboxylic acid different from A, 4 to 10 g/l dispersed particles, different from the nickel/phosphorus alloy composition and no boric acid or borates and objects coated therewith.

公开(公告)号：EP1078114A4

公开(公告)日：2006-12-06

申请号：EP99921772

申请日：1999-05-10

申请人： MCCOMAS TECHNOLOGIES AG ,  MCCOMAS EDWARD

发明人： MCCOMAS EDWARD

IPC分类号： B32B15/01 ,  B23B15/00 ,  B32B15/00 ,  C23C20060101 ,  C23C18/16 ,  C23C18/34 ,  C23C18/50 ,  C23C22/00

CPC分类号： C23C18/50 ,  C23C18/1692 ,  C23C18/34

摘要： This invention is directed to plating using a coating bath that provides a hard, wear and corrosion resistant, ductile coating on a substrate, said bath having a pH of about 10 to about 14 and comprising: (1) about 0.175 to about 2.10 moles per gallon of coating bath of nickel ions; (2) an effective amount of lead tungstate to stabilize the bath and to form a continuous coating free from blotches without any substantial deposition of lead tungstate in the coating; (3) an effective amount of metal ion complexing agent in an amount sufficient to inhibit precipitation of said metal ions from the coating bath; and (4) an effective amount of a borohydride reducing agent.