-
101.发明公开
公开(公告)号：EP4098777A1
公开(公告)日：2022-12-07
申请号：EP21746984.0
申请日：2021-01-04
摘要： This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D).
In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.-
公开(公告)号：EP3288991B1
公开(公告)日：2020-03-18
申请号：EP15890233.8
申请日：2015-04-28
IPC分类号： C08G73/10 , C07D241/04 , C07D413/10 , C07D265/33 , C09D179/02 , C09D179/08 , C08G73/02 , C25D3/38 , C25D3/32 , C25D3/58 , C25D3/60 , C07D413/06 , C07D413/12
-
公开(公告)号：EP3124653B1
公开(公告)日：2018-10-17
申请号：EP16178528.2
申请日：2016-07-08
发明人： Lee, Kun-Hsin , Chen, Ying-Jin , Feng, Tzu-Hua , Her, Li-Jane , Chiang, Chia-Jun
IPC分类号： C25D3/38 , C25D3/12 , C25D3/32 , C07C1/00 , C07C323/66
CPC分类号： C25D3/12 , C07C323/52 , C07C323/66 , C25D3/30 , C25D3/32 , C25D3/38
摘要： The present invention provides a carboxyl sulfonate compound and preparation method thereof. The present carboxyl sulfonate compound has structure of formula (A): wherein M 1 is hydrogen or an alkali metal; M 2 is hydrogen, alkyl or an alkali metal; Y is hydrogen, alkyl; carboxyl, carboxyl salt; alkylcarboxyl, or alkylcarboxyl salt; n is an integer from 1 to 10; and m is an integer from 1 to 10. The carboxylic group and the sulfonic acid group in the structure of the present carboxyl sulfonate compound show excellent chelating ability to metal ions; therefore, the present carboxyl sulfonate compound is particularly for use in electroplating additive.
-
公开(公告)号：EP3040451B1
公开(公告)日：2018-07-25
申请号：EP15194686.0
申请日：2015-11-16
IPC分类号： C25D7/12 , C25D3/32 , C25D3/38 , C25D3/58 , C07D303/04 , C07D303/18
CPC分类号： C25D3/38 , C07D303/04 , C07D303/18 , C25D3/32 , C25D3/58 , C25D7/123
摘要： Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
-
105.发明公开
公开(公告)号：EP3150746A4
公开(公告)日：2018-07-04
申请号：EP14893424
申请日：2014-05-30
发明人： TANAKA KOICHIRO
IPC分类号： C25D7/06 , B32B15/00 , C23C18/54 , C23C28/02 , C23C30/00 , C25D3/12 , C25D3/32 , C25D3/56 , C25D5/12 , C25D5/50 , H05K9/00
CPC分类号： C23C28/02 , B32B15/00 , C23C18/54 , C23C30/00 , C25D3/12 , C25D3/32 , C25D3/562 , C25D5/12 , C25D5/505 , C25D7/0614 , H05K9/00
摘要： A metal foil for electromagnetic shielding10, comprising a base 1 consisting of a metal foil, an underlayer 2 including Ni formed on one or both surfaces of the base, and a Sn-Ni alloy layer 3 formed on a surface of the underlayer, wherein the Sn-Ni alloy layer includes 20 to 80 weight% of Sn, and when a total deposition amount of Sn is represented by T Sn [µg/dm 2 ], a percentage of Sn in the Sn-Ni alloy is represented by A Sn [weight%], a total deposition amount of Ni is represented by T Ni [µg/dm 2 ], and a percentage of Ni in the Sn-Ni alloy is represented by A Ni [weight%], T Sn : 500 to 91000 µg/dm 2 , T Ni : 2200 to 236000 µg/dm 2 , 170000 => {T Ni -T Sn x (A Ni /A Sn )} => 1700.
-
公开(公告)号：EP3276046A1
公开(公告)日：2018-01-31
申请号：EP16768889.4
申请日：2016-03-24
发明人： WATANABE Mami , NAKAYA Kiyotaka
CPC分类号： C25D3/32 , C25D3/60 , C25D7/12 , H01L24/11 , H01L24/13 , H01L2224/11462 , H01L2224/13111 , H05K3/188 , H05K3/4007
摘要： A plating solution including (A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt thereof; and (C) an additive containing a specific ammonium salt is provided.
摘要翻译： 一种电镀液，其包含（A）至少含有亚锡盐的可溶性盐; （B）选自有机酸和无机酸或其盐的酸; 和（C）提供含有特定铵盐的添加剂。
-
公开(公告)号：EP3156522A4
公开(公告)日：2017-11-08
申请号：EP15807050
申请日：2015-06-04
申请人： UEMURA KOGYO KK
CPC分类号： C25D3/32
-
108.发明公开STANNOUS METHANSULFONATE SOLUTION WITH ADJUSTED PH 审中-公开ZINN-METHANSULFONAT-LÖSUNGMIT EINGESTELLTEM PH-WERT
公开(公告)号：EP3077578A4
公开(公告)日：2017-07-26
申请号：EP14867847
申请日：2014-12-02
申请人： HONEYWELL INT INC
IPC分类号： C25D3/32
CPC分类号： C25D3/32 , C07F7/2244
-
公开(公告)号：EP2868778A3
公开(公告)日：2015-08-12
申请号：EP14191883.9
申请日：2014-11-05
CPC分类号： C25D3/32 , C25D3/60 , C25D7/123 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/94 , H01L2224/05611 , H01L2224/05655 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/94 , H05K3/3473 , H01L2924/00012 , H01L2924/00014 , H01L2224/11 , H01L2924/01047 , H01L2924/01079 , H01L2924/01029 , H01L2924/01083 , H01L2924/01049 , H01L2924/0103 , H01L2924/01051 , H01L2924/01025 , H01L2924/014 , H01L2924/01322 , H01L2924/01026
摘要： Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.
-
110.发明公开SURFACE-TREATED STEEL SHEET ON WHICH PARTICULATE TIN IS DEPOSITED AND RESIN-COATED STEEL SHEET 有权表面处理钢板，沉积的颗粒锡和树脂涂层钢板
公开(公告)号：EP2381016A4
公开(公告)日：2014-09-24
申请号：EP09833105
申请日：2009-10-14
申请人： TOYO KOHAN CO LTD
发明人： MATSUBARA MASANOBU
CPC分类号： B32B15/08 , B32B7/12 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/06 , B32B2255/205 , B32B2270/00 , B32B2307/412 , B32B2307/714 , B32B2307/732 , B32B2439/66 , C25D5/36 , C25D5/505
-
-
-
-
-
-
-
-
-
搜索结果
168 条记录 (耗时 0.015 秒)
