公开(公告)号：EP2801802A1

公开(公告)日：2014-11-12

申请号：EP14173959.9

申请日：2008-06-10

Applicant: Hamamatsu Photonics K.K.

Inventor： Shibayama, Katsumi ,  Yokino, Takafumi ,  Suzuki, Tomofumi ,  Teichmann, Helmut ,  Hiller, Dietmar ,  Starker, Ulrich

IPC: G01J3/02 ,  G01J3/18

CPC classification number: G01J3/18 ,  G01J3/02 ,  G01J3/0205 ,  G01J3/0208 ,  G01J3/0237 ,  G01J3/0259 ,  G01J3/0291

Abstract: A spectroscopy module comprises a light transmitting portion for transmitting light made incident upon a plane of the light transmitting portion. The spectroscopy module further comprises a spectroscopic portion which is provided on a convex surface of the light transmitting portion, opposite the plane, to disperse light transmitted through the light transmitting portion and reflect said light towards the plane. The spectroscopy module further comprises a light detecting element which is provided on the plane to detect light dispersed and reflected by the spectroscopic portion. The spectroscopic portion comprises a diffracting layer formed along the convex surface of the light transmitting portion, a reflecting layer formed on a surface of the diffracting layer, and a peripheral edge portion formed on the convex surface of the light transmitting portion. The peripheral edge portion is formed integrally with the diffracting layer, and by using a same material as that of the diffracting layer, so as to enclose a periphery of the diffracting layer.

Abstract translation: 光谱模块包括用于透射入射在光透射部分的平面上的光的光透射部分。 光谱模块还包括分光部分，其设置在透光部分的与平面相对的凸表面上，以分散透过透光部分的光并将光反射到平面。 光谱模块还包括光检测元件，其设置在平面上以检测由分光部分分散和反射的光。 分光部包括沿着透光部的凸面形成的衍射层，形成在衍射层的表面上的反射层和形成在透光部的凸面上的周缘部。 周边部分与衍射层一体形成，并且通过使用与衍射层相同的材料，以包围衍射层的周边。

公开(公告)号：EP2287579A4

公开(公告)日：2014-04-16

申请号：EP09746534

申请日：2009-05-08

Applicant: HAMAMATSU PHOTONICS KK

Inventor： SHIBAYAMA KATSUMI

IPC: G01J3/18 ,  G01J3/02 ,  G02B7/00

CPC classification number: G02B5/1861 ,  G01J3/02 ,  G01J3/0208 ,  G01J3/024 ,  G01J3/0243 ,  G01J3/0259 ,  G01J3/0291 ,  G01J3/18 ,  Y10T29/4998

Abstract: First, a box 5 molded from a resin is prepared such as to have a rectangular parallelepiped outer form with a pair of grooves on the bottom face and a semispherical recess 9. Subsequently, a photocurable resin agent 27 is applied to a bottom area 12 of the recess 10 in the box 5. Then, while a light transmitting mold 28 having a bottom face formed with a plurality of grating grooves arranged in a row along a predetermined direction is pressed against the applied resin agent 27, the resin agent 27 is cured by irradiation with light, so as to provide the area 12 in the recess 10 with the grating 29 formed with a plurality of grating grooves. Next, Al, Au, or the like is vapor-deposited so as to cover the grating 29, thereby forming a reflecting film 15. Then, a photodetector 4 is accommodated in a package 2. This can easily manufacture a highly reliable spectrometer.

公开(公告)号：EP2290340A4

公开(公告)日：2014-01-22

申请号：EP09746523

申请日：2009-05-07

Applicant: HAMAMATSU PHOTONICS KK

Inventor： SHIBAYAMA KATSUMI ,  YOKINO TAKAFUMI ,  KASAHARA TAKASHI ,  ITO MASASHI ,  YOSHIDA ANNA

IPC: G01J3/18 ,  G02B7/00

CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/0297 ,  G01J2003/1213 ,  G02B5/1814 ,  G02B7/025 ,  Y10T156/10

公开(公告)号：EP2287574A4

公开(公告)日：2014-01-08

申请号：EP09746522

申请日：2009-05-07

Applicant: HAMAMATSU PHOTONICS KK

Inventor： SHIBAYAMA KATSUMI ,  YOKINO TAKAFUMI ,  HIROSE MASAKI ,  ITO MASASHI

IPC: G01J3/18 ,  G02B7/00

CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/0297 ,  G01J2003/1213 ,  G02B5/1814 ,  G02B5/1852 ,  G02B5/1861 ,  G02B7/025 ,  G02B27/4244

公开(公告)号：EP2676109A1

公开(公告)日：2013-12-25

申请号：EP12747871.7

申请日：2012-02-14

Applicant: Luxmux Technology Corporation

Inventor： DATTNER, Yonathan ,  YADID-PECHT, Orly

IPC: G01J3/12 ,  G01J3/433 ,  G01J3/44 ,  G02B27/10 ,  G02B6/12 ,  H01L31/16

CPC classification number: G01J3/45 ,  C08L79/08 ,  G01J3/0259 ,  G01J3/44 ,  G01J3/4531 ,  G02B6/125 ,  G02B6/13 ,  G02B6/29344 ,  G02B6/2935

Abstract: A Fourier Transform Infrared (FTIR) Spectrometer integrated in a CMOS technology on a Silicon-on-Insulator (SOI) wafer is disclosed. The present invention is fully integrated into a compact, miniaturized, low cost, CMOS fabrication compatible chip. The present invention may be operated in various infrared regions ranging from 1.1 mum to 15 mum or it can cover the full spectrum from 1.1 mum to 15 mum all at once. The CMOS-FTIR spectrometer disclosed herein has high spectral resolution, no movable parts, no lenses, is compact, not prone to damage in harsh external conditions and can be fabricated with a standard CMOS technology, allowing the mass production of FTIR spectrometers. The fully integrated CMOS-FTIR spectrometer is suitable for battery operation; any and all functionality can be integrated on a chip with standard CMOS technology. The disclosed invention for the FTIR spectrometer may also be adapted for a CMOS-Raman spectrometer.

公开(公告)号：EP2469252A1

公开(公告)日：2012-06-27

申请号：EP10809902.9

申请日：2010-08-11

Applicant: Hamamatsu Photonics K.K.

Inventor： SHIBAYAMA Katsumi ,  YOKINO Takafumi

IPC: G01J3/18 ,  G01J3/36 ,  G02B5/10 ,  G02B5/18 ,  H01L31/10

CPC classification number: G01J3/18 ,  G01J3/02 ,  G01J3/0202 ,  G01J3/0208 ,  G01J3/021 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/2803 ,  G02B5/1814 ,  G02B5/1852 ,  G02B5/1861

Abstract: In a spectroscopic module 1, a flange 7 is formed integrally with a diffraction layer 6 along a periphery thereof so as to become thicker than the diffraction layer 6. As a consequence, at the time of releasing a master mold used for forming the diffraction layer 6 and flange 7, the diffraction layer 6 formed along a convex curved surface 3a of a main unit 3 can be prevented from peeling off from the curved surface 3 a together with the master mold. A diffraction grating pattern 9 is formed so as to be eccentric with respect to the center of the diffraction layer 6 toward a predetermined side. Therefore, releasing the mold earlier from the opposite side of the diffraction layer 6 than the predetermined side thereof can prevent the diffraction layer 6 from peeling off and the diffraction grating pattern 9 from being damaged.

公开(公告)号：EP2366985A3

公开(公告)日：2012-05-30

申请号：EP11156872.1

申请日：2011-03-03

Applicant: Seiko Epson Corporation

Inventor： Uematsu, Akira ,  Sato, Yoichi ,  Komatsu, Akira ,  Yano, Kunihiko

IPC: G01J3/02 ,  G01J3/36 ,  G02B5/20 ,  H01L27/146 ,  G01J3/12

CPC classification number: G01N21/31 ,  G01J3/02 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0262 ,  G01J3/0278 ,  G01J3/28 ,  G01J3/36 ,  G01J3/51 ,  G01J2003/1226 ,  G02B5/285 ,  G02B7/006 ,  H01L27/1443 ,  H01L27/14625

Abstract: A spectroscopic sensor 100 that applies lights in a wavelength band containing plural wavelengths to an object and spectroscopically separates reflected lights or transmitted lights from the object using plural light band-pass filters 61 to 64 that transmit the respective specific wavelengths and plural photosensor parts 31 to 34 to which corresponding transmitted lights are input based on output results of independent photosensors. The spectroscopic sensor 100 may be integrated in a semiconductor device or module by integration using a semiconductor process and downsizing may be realized.

公开(公告)号：EP2407761A2

公开(公告)日：2012-01-18

申请号：EP11175172.3

申请日：2007-04-23

Applicant: Corning Incorporated

Inventor： Comstock, Lovell

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/18 ,  G02B5/18

CPC classification number: G01J3/18 ,  G01J3/02 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/04 ,  G01J3/2823 ,  G02B5/1852

Abstract: A monolithic Offner spectrometer is described herein as are various components like a diffraction grating and a slit all of which are manufactured by using a state-of-the-art diamond machining process. In one embodiment, a monolithic Offner spectrometer is directly manufactured by using a diamond machining process. In another embodiment, a monolithic Offner spectrometer is manufactured by using molds which are made by a diamond machining process. In yet another embodiment, a diffraction grating is directly manufactured by using a diamond machining process. In still yet another embodiment, a diffraction grating is manufactured by using a mold which is made by a diamond machining process. In yet another embodiment, a slit is directly manufactured by using a diamond machining process.

Abstract translation: 本文描述了单片Offner光谱仪，如衍射光栅和狭缝一样的各种组件，所有这些都是通过使用最新的金刚石加工工艺制造的。 在一个实施例中，通过使用金刚石加工工艺直接制造单片Offner光谱仪。 在另一个实施例中，单片Offner光谱仪通过使用由金刚石机加工工艺制成的模具来制造。 在又一个实施例中，通过使用金刚石加工工艺直接制造衍射光栅。 在又一个实施例中，衍射光栅通过使用由金刚石加工工艺制成的模具来制造。 在又一个实施例中，通过使用金刚石加工工艺直接制造狭缝。

公开(公告)号：EP2366985A2

公开(公告)日：2011-09-21

申请号：EP11156872.1

申请日：2011-03-03

Applicant: Seiko Epson Corporation

Inventor： Uematsu, Akira ,  Sato, Yoichi ,  Komatsu, Akira ,  Yano, Kunihiko

IPC: G01J3/02 ,  G01J3/36 ,  G02B5/20 ,  H01L27/146 ,  G01J3/12

CPC classification number: G01N21/31 ,  G01J3/02 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0262 ,  G01J3/0278 ,  G01J3/28 ,  G01J3/36 ,  G01J3/51 ,  G01J2003/1226 ,  G02B5/285 ,  G02B7/006 ,  H01L27/1443 ,  H01L27/14625

Abstract: A spectroscopic sensor 100 that applies lights in a wavelength band containing plural wavelengths to an object and spectroscopically separates reflected lights or transmitted lights from the object using plural light band-pass filters 61 to 64 that transmit the respective specific wavelengths and plural photosensor parts 31 to 34 to which corresponding transmitted lights are input based on output results of independent photosensors. The spectroscopic sensor 100 may be integrated in a semiconductor device or module by integration using a semiconductor process and downsizing may be realized.

Abstract translation: 一种分光传感器100，其将包含多个波长的波长带中的光施加到物体，并且使用将各个特定波长和多个光电传感器部31发送的多个光带通滤波器61至64对物体进行光谱分离，从而反射光或透射光 34，基于独立光电传感器的输出结果输入相应的透射光。 光谱传感器100可以通过使用半导体工艺的集成而集成在半导体器件或模块中，并且可以实现小型化。

公开(公告)号：EP2287578A1

公开(公告)日：2011-02-23

申请号：EP09746533.0

申请日：2009-05-08

Applicant: Hamamatsu Photonics K.K.

Inventor： SHIBAYAMA Katsumi

IPC: G01J3/18 ,  G02B7/00

CPC classification number: G02B5/1861 ,  G01J3/02 ,  G01J3/0208 ,  G01J3/024 ,  G01J3/0243 ,  G01J3/0259 ,  G01J3/0291 ,  G01J3/18

Abstract: A spectrometer 1, in which a spectroscopic unit 3 spectrally resolves and reflects light L1 having entered the inside of a package 2 while a photodetector 4 detects reflected light L2, comprises a package 2 accommodating the photodetector 4 therein. The package 2 has a semispherical recess 10, while the recess 10 has a bottom face formed with an area 12 having a plurality of grating grooves 14 arranged in a row along a predetermined direction and an area 13 surrounding the area 12. The areas 12 and 13 are continuous with each other and formed on the same curved surface. This can inhibit the grating grooves 14 from shifting their positions even when distortions are generated in the package 2.

Abstract translation: 其中分光单元3在光电检测器4检测到反射光L2的同时光谱地分辨和反射已经进入封装2的内部的光L1，其中包括容纳光电检测器4的封装2。 封装2具有半球形凹部10，而凹部10具有形成有沿着预定方向排列成一排的多个格栅槽14的区域12的底面和围绕区域12的区域13.区域12和 13彼此连续并形成在相同的曲面上。 即使在包装2中产生失真的情况下，也可以抑制光栅槽14的位置偏移。