SURFACE-ENHANCED RAMAN SCATTERING ELEMENT
    3.
    发明公开

    公开(公告)号:EP2889607A4

    公开(公告)日:2016-09-28

    申请号:EP13828677

    申请日:2013-08-09

    CPC classification number: G01N21/658 B82Y40/00 G01N21/03 G01N2201/068

    Abstract: A SERS element 3 comprises a substrate 4; a fine structure part 7 formed on a front face 4a of the substrate 4 and having a plurality of pillars 11; and a conductor layer 6 formed on the fine structure part 7 and constituting an optical function part 10 for generating surface-enhanced Raman scattering. The conductor layer 6 has a base part formed along the front face 4a of the substrate 4 and a plurality of protrusions protruding from the base part at respective positions corresponding to the pillars 11. The base part and the protrusions form a plurality of gaps G in the conductor layer 6, each of the gaps G having an interstice gradually decreasing in a direction perpendicular to the projecting direction of the pillar 11.

    MANUFACTURING METHOD FOR SURFACE-ENHANCED RAMAN SCATTERING ELEMENT
    8.
    发明公开
    MANUFACTURING METHOD FOR SURFACE-ENHANCED RAMAN SCATTERING ELEMENT 审中-公开
    方法表面强化拉曼散射元件

    公开(公告)号:EP2884266A4

    公开(公告)日:2016-08-10

    申请号:EP13828340

    申请日:2013-08-09

    CPC classification number: G01J3/0205 G01J3/4412 G01N21/658 Y10T29/49155

    Abstract: A method for making a surface enhanced Raman scattering element in accordance with one aspect of the present invention comprises a first step of forming a nanoimprint layer on a main surface of a wafer including a plurality of portions each corresponding to a substrate; a second step of transferring, by using a mold having a pattern corresponding to a fine structural part, the pattern to the nanoimprint layer after the first step, and thereby forming the molded layer including the fine structural part for each portion corresponding to the substrate; a third step of forming a conductor layer on the fine structural part after the second step; and a fourth step of cutting the wafer into each portion corresponding to the substrate after the second step.

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