Abstract:
A heat-resistant endless resin belt (10) including a heat-resistant resin sheet, which can be employed in a thermal fixing apparatus, wherein the sheet includes two cutting work parts in an inclined shape. The two parts are overlapped with each other and bonded with an adhesive to form a bonding part. An external shape displacement f (x), measured via a flatness measuring apparatus, which scans the belt (10) in a width direction thereof, satisfies a following formula ∫ o x | f x - g x | dx ≤ XL 6800 , wherein "X" (mm) is a length of the belt (10) in a width direction thereof ; "L" (mm) is a perimeter of the belt (10) and "g (x)" represents a displacement of an ideal shape of the heat-resistant resin belt (10), when g (x) = C (a constant), a left side of the formula is set to be a minimum; whilst when g (x) is a variable, the displacement of the ideal shape of the heat-resistant resin belt (10) is set.
Abstract:
A part program is analyzed and measurement information or measurement conditions are extracted in the measurement of coordinates and surface properties under control of the part program. Optimal measurement conditions in the actual measurement are reflected on the part program by storing the extracted measurement conditions rewritably, so that actual measurement conditions can be added to the subsequent measurement control.
Abstract:
A device and a method for measuring and quantifying waviness of sheet materials such as paper. The device in accordance with one embodiment comprises a base having a planar, smooth, and level upper surface for supporting a stack of sheets thereon, a plate-shaped weight for placing atop the stack of sheets, and a measuring device for measuring a vertical distance between a datum surface defined by the weight and a datum surface defined by the base. The measured distance is an indication of the height of the stack. In a preferred embodiment, the device also includes a programmed processor operable to calculate a "Wavy Ratio" based on the measured actual height H of the stack and a calculated "ideal" height of the stack, as Wavy Ratio = H / (n · t), where n is the number of sheets and t is the average caliper of the sheets.
Abstract translation:用于测量和定量纸张材料如纸的波纹的装置和方法。 根据一个实施例的装置包括具有平面,平滑和平坦的上表面的基座,用于支撑其上的一叠片材,用于放置在一叠片材上的板状重物,以及用于测量垂直距离的测量装置 在由重量限定的基准表面和由基座限定的基准面之间。 测量的距离是堆叠高度的指示。 在优选实施例中,装置还包括编程处理器,其可操作以基于所测量的堆叠的实际高度H和所计算的堆叠的“理想”高度来计算“波浪比”,如波形比= H /(n· t),其中n是纸张的数量,t是纸张的平均厚度。
Abstract:
There is provided a heterodyne laser Doppler probe capable of realizing the compatibility between its photoexcitation efficiency and speed measurement efficiency, and a measurement system using the same is also disclosed. The heterodyne laser Doppler probe introduces excitation light for photoexcitation from a first optical path (2) to an optical probe (1) and measurement light for heterodyne laser Doppler measurement from a second optical path (4) to the optical probe (1). After emission from the first optical path (2), the excitation light is introduced through a reflection mirror (3) and a beam splitter (6) into a focal lens (7), and then into a measurement object (excitation object) (8). On the other hand, the measurement light for heterodyne laser Doppler measurement is emitted from the second optical path (4) and passes through a 1/4 wavelength plate (5). Here, linearly polarized light is converted into circularly polarized light, and introduced through a beam splitter (5) and the focal lens (7) into the measurement object (excitation object) (8). The measurement light (signal light) reflected by the measurement object (excitation object) (8) passes through the same route to reach the 1/4 wavelength plate (5). By the 1/4 wavelength plate (5), the measurement light is converted from the circularly polarized light into the linearly polarized light, and the linearly polarized measurement light is returned through the second optical path (4) to the heterodyne laser Doppler measurement device.
Abstract:
A low-cost homodyne laser interferometer probe of simple structure is provided which allows predetermined performance to be easily obtained by a simple adjustment, and a displacement measurement system using the same is also disclosed. The homodyne laser interferometer probe includes an optical fiber (1) for guiding light, a collimator lens (2) that receives the light from the optical fiber (1), a 1/4 wavelength plate (3) that receives light from the collimator lens (2) and that converts the light from linearly polarized light into circularly polarized light, a beam splitter (4) for dividing light from the 1/4 wavelength plate (3) into reference light and measurement light, a first focal lens (5) that receives the reference light from the beam splitter (4), a reflection mirror (6) for reflecting the reference light from the first focal lens (5), and a second focal lens (7) that receives the measurement light from the beam splitter (4). Here, the reference light from the reflection mirror (6) is returned to measurement means along the same route. The measurement light from the second focal lens (7) is applied to a measurement object (8), and the measurement light (signal light) from the measurement object (8) is returned to the measurement means along the same route.
Abstract:
A surface position measuring method capable of measuring a position on a soft surface accurately and rapidly (real time), with low invasiveness. The method comprises the steps of measuring the spectrum of thermal oscillation of a cantilever with the distance between a cantilever tip and a sample surface being changed, extracting a fundamental mode component (spectrum area) from the obtained spectrum of thermal oscillation, and measuring a change in the spectrum area of thermal oscillation (spectrum area) with respect to the distance. A position at which the area of the cantilever thermal oscillation spectrum begins to change is evaluated as a position on the sample surface.
Abstract:
A method of measuring warpage of a rear surface of a substrate includes a substrate detection step (S1), a best fit plane calculation step (S5), and a warpage calculation step (S6). Further, the method of measuring warpage of a rear surface of a substrate can further includes after the substrate detection step (S1) and before the best fit plane calculation step (S5): a noise removal step (S2) and an outer peripheral portion removal step (S3); the outer peripheral portion removal step (S3) and a smoothing step (S4); or the noise removal step (S2), the outer peripheral portion removal step (S3), and the smoothing step (S4). Thereby, a method of measuring warpage of a rear surface with a high surface roughness of a substrate can be provided.
Abstract:
A nanotweezer (1) according to the present invention includes: a supporting member (25); an observation probe (10) that projects out from the supporting member (25), and is used when observing a surface of a specimen; a movable arm (20) that is arranged next to the observation probe (10) projecting out from the supporting member (25), and makes closed or opened between the observation probe (10) and the movable arm (20) to hold or release the specimen held between the observation probe (10) and the movable arm (20); and a drive mechanism that drives the movable arm (20) so as to make closed or opened between the observation probe (10) and the movable arm (20), and the supporting member (25), the observation probe (10) and the movable arm (20) are each formed by processing a semiconductor wafer (30) through a photolithography process.
Abstract:
Problems to be solved include problems of an expense in replacing a manual type of roundness measurement apparatus with an automatic type of roundness measurement apparatus; a repair time for maintenance, overhaul or the like of the roundness measurement apparatus; a cost of a replacement component during repair; and the like. According to the present invention, in a manual type roundness measurement apparatus comprising a measurement device which measures a state of a peripheral surface of an object to be measured; a columnar measurement base capable of adjusting a misalignment and a tilt of the object to be measured on the measurement device; and a computer calculation processing device which processes measurement data of the measurement base, the measurement base includes a driving unit having a handle; automatic unit sections comprising motor units connected to the driving unit 5a; and a substrate which controls the automatic unit sections, whereby the manual type roundness measurement apparatus can be changed to a constitution of an automatic type.