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121.发明授权
公开(公告)号：EP1222321B8
公开(公告)日：2004-11-03
申请号：EP00975832
申请日：2000-10-05
发明人： HUEBEL EGON
CPC分类号： H05K3/241 , C25D7/0621 , C25D17/28
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122.发明授权
公开(公告)号：EP1088117B1
公开(公告)日：2004-08-25
申请号：EP99957174.8
申请日：1999-06-18
发明人： RUMPF, Thomas
摘要： The invention relates to a method for depositing a metallic layer on a polymer surface of a workpiece. After seeding with a catalytically active platinum metal or a platinum metal compound, a coating metal is autocatalytically separated from an aqueous solution onto said surface, without external current input. Next, at least one further layer is deposited on the preliminary layer, preferably electrolytically and with external current input. According to the invention, to obtain advantageous construction conditions centres of a Lewis acid or Lewis base are enriched on the polymer surface to be coated by means of vacuum plasma processing with a plasma gas suitable for the polymer used, after which the polymer surface is seeded under vacuum with the platinum metal or platinum metal compound, using a further plasma gas which contains an evaporated platinum metal or platinum metal compound designed for nucleophilic or electrophilic reaction with the Lewis acids or Lewis bases.
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123.发明公开
公开(公告)号：EP1354073A2
公开(公告)日：2003-10-22
申请号：EP01949313.9
申请日：2001-05-04
CPC分类号： B01D61/027 , B01D61/145 , C23C18/1617 , C25D21/20
摘要： The invention relates to a method for the treatment of work pieces with a palladium colloid solution by bringing the work pieces into contact with the colloid solution, palladium being recovered after the use of the colloid solution. This is achieved by separating palladium colloid particles from the colloid liquid by means of a molecular filter. With this method it is easy to continuously and largely completely separate palladium from the spent processing solutions without investing large amounts of chemicals, energy and time. The spent processing solution may especially be worked up after separation of the part of the solution containing palladium such that palladium can be recovered completely and be reused for further processing.
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公开(公告)号：EP1309740A2
公开(公告)日：2003-05-14
申请号：EP01940178.5
申请日：2001-04-11
发明人： HÜBEL, Egon
IPC分类号： C25D1/00
CPC分类号： C25D7/0657 , H05K3/241
摘要： For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10 , more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.
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125.发明公开REMOVAL OF ORTHOPHOSPHITE IONS FROM ELECTROLESS NICKEL PLATING BATHS 失效电气去除亚磷酸地段NICKELPLATTIERUNGSBÄDERN
公开(公告)号：EP0894156A4
公开(公告)日：2002-06-26
申请号：EP97949429
申请日：1997-11-13
CPC分类号： C23C18/1617 , C23C18/36
摘要： Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium. In order to avoid the precipitation of calcium sulfate and the generation of large amounts of particulates in the bath, nickel sulfate can be replaced by a nickel salt of an alkylsulfonic acid or hypophosphorous acid, whose anion forms a soluble salt with an alkali metal or alkaline earth metal cation.
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126.发明公开Plating bath and method for electroplating tin-zinc alloys 有权Plattierungsbad und Verfahren zur Plattierung von Zinn-Zink Legierungen
公开(公告)号：EP1201789A2
公开(公告)日：2002-05-02
申请号：EP01124311.0
申请日：2001-10-19
IPC分类号： C25D3/60
CPC分类号： C25D3/60
摘要： The present invention relates to an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary ammonium polymer. The plating baths also may contain one or more of the following additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal complexing agents. The plating baths of this invention deposit a bright and level deposit, and they can be adapted to provide plated alloys having high tin concentration over a wide current density range.
摘要翻译： 本发明涉及一种用于电沉积锡 - 锌合金的含水电镀液，其包含至少一种溶于水的亚锡盐，至少一种溶液可溶性锌盐和季铵聚合物，所述季铵聚合物选自脲芳季铵聚合物，亚氨基亚乙基季铵 铵聚合物或硫脲类季铵聚合物。 电镀浴还可以含有一种或多种以下添加剂：羟基多元羧酸或其盐如柠檬酸; 铵盐; 导电盐 含芳香族羰基化合物; 脂族胺的聚合物，例如聚（亚烷基亚胺）; 和羟烷基取代的二胺作为金属络合剂。 本发明的镀浴沉积明亮的水平沉积物，并且它们可适用于在宽的电流密度范围内提供具有高锡浓度的电镀合金。
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127.发明授权VORRICHTUNG ZUM PARTIELLEN ELEKTROCHEMISCHEN BEHANDELN VON STABFÖRMIGEM BEHANDLUNGSGUT 有权DEVICE FOR PARTIAL电化学治疗棒状的被处理材料
公开(公告)号：EP1115912B1
公开(公告)日：2002-03-20
申请号：EP99950440.0
申请日：1999-07-23
摘要： According to the invention, rod-shaped objects (10) (bars having different lengths and diameters) are partially treated electrochemically (electroplating, etching) in a dip facility in a device. Stationary tubular electrodes (30) are located in the treatment bath of said facility, wherein the bars (10) are inserted centrally. The surfaces to be treated are axially delimited by an adjustable membrane support (26), wherein elastic protective membranes (9) are disposed to delimit the field lines. The membranes (9) are supported by the membrane supports (5). The membrane supports (5) are disposed in a cage in such a way that they can move radially and are fitted with inner centering springs (7) and outer centering springs (19) so that the membrane supports (5) and the membranes (9) are retained in a self-centered manner.
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128.发明授权
公开(公告)号：EP1015667B1
公开(公告)日：2002-03-20
申请号：EP98949944.7
申请日：1998-08-19
IPC分类号： C25D1/00
摘要： The invention relates to a method and device for regulating the concentration of metal ions in electrolytic fluid for depositing metal using insoluble anodes. Said electrolytic metal also contains compounds of an electrochemically reversible redox system. Metal is dissolved with its oxidized form in an ion generator (1) which is cross-flown by said fluid in such a way that the compounds are reduced. The dissolved metal ions reduced on the items to be treated in order to deposit metal. The compounds of the redox system are re-oxidized in their reduced form on the insoluble anodes in the electroplating plant (13). In order to keep the concentration of metal ions constant in the electrolytic fluid, at least one part of the electrolytic fluid contained in the electroplating plant is conducted through one or several auxiliary electrolysis cells (6) with at least one insoluble anode (8) and at least one cathode (7) and a sufficiently high electric current flow is regulated between the anodes and cathodes pertaining to the auxiliary cells so that the current density on the surface of the anodes is at least 6 A/dm and the current density on the surface of the cathodes is at most 3 A/dm . The ratio between the surface of the anodes and the surface of the cathodes pertaining to the auxiliary cells is thus regulated to at least 1:4.
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公开(公告)号：EP1115915A2
公开(公告)日：2001-07-18
申请号：EP99947211.1
申请日：1999-07-13
发明人： LANGHEINRICH, Peter
CPC分类号： C25D7/00 , C25D7/0614 , C25D17/00 , C25D17/06 , C25D17/08 , C25D17/12 , H01B1/00 , H05K3/18 , H05K3/24
摘要： It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs ( 6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are disposed on the contact organs (6, 7). The shape of the contact surfaces (26) are configured in such a way that no damages occur in the areas of the conductive surfaces adjacent to the contact surfaces (26) when large currents are transmitted from the contact elements (15, 16) printed on the electrically conductive surface of printed board material (L) on the contact surfaces to the conductive surface.
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公开(公告)号：EP1080247A2
公开(公告)日：2001-03-07
申请号：EP99926265.2
申请日：1999-04-15
发明人： MEYER, Heinrich , SCHULZ, Ralf , HEINZ, Roland , KLUSMANN, Eckart
CPC分类号： H05K3/388 , C23C16/0245 , C23C16/06 , H05K1/034 , H05K3/146
摘要： Known methods exist for producing the required substrate materials for electric circuit carriers, whereby metal coatings are applied to a dielectric substrate using a glow-discharge method and other metal coatings are applied using an electroplating method. These methods are, however, not suitable for the production of substrate materials that can be used for high frequency applications in the giga hertz range. The invention builds upon the previously cited methods and solves the problem linked thereto by using fluoropolymers and by coating these materials with nickel in a glow-discharge method, whereby very flat surfaces of the substrate can also be given an adhesive coating. The metallized materials can be covered with other metal coatings from electroless or electrolytic separation baths.
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